A new function for PowerSelective compensates product or production-related warpage of assemblies to be processed. During program generation for the mini-wave soldering process, the operator specifies all board areas that are mechanically supported and gives a correct z-level. A reference point is defined. The operator specifies an arbitrary number of points on the soldering side of the assembly. A high-precision laser measuring system determines the distance of the PCB from the previously defined points prior to soldering. These values and the z height of the reference point are the basis for a precise calculation for modeling and illustrating an altitude profile. All points of the soldering program are set off against the modeled value. PCB warpage compensation, with the automatic PCB alignment based on fiducial recognition, guarantees reproducible xyz positioning.

SEHO Systems, www.seho.de

• Prev
• Next