Mini-Oven Reball/Solder Bumping unit 04 provides controlled air circulation; hot air continually flows around the component, heating it equally from all sides. Offers programmable modes and a nitrogen process gas supply for minimizing solder oxidation. Up to 99 profiles can be stored, with the ability to edit individual profiles and fine-tune parameters. Reballing function is capable of handling diverse range of BGAs, as well as QFNs and CSPs. Rapid Technology soldering profiles apply settings within the permitted thermal limits, heat at the highest advisable thermal ramp rates, and maintain a safe temperature zone. Is ideal for the complete QFN solder bumping process. Uses Hotprint Technology; mask remains on the QFN during reflow.

Martin, www.bgarework.com

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