VT-X700 inline, automated 3D CT x-ray analyzes printed circuit boards, including those with hidden solder joints. Inspects solder quality on components from BGAs to chips, and through-hole devices. Inspections are performed at 5 sec. per field-of-view. Gauges PCB surface for each solder joint, compensating for warpage; performs cross-sectional analysis at slice-level locations. Has selectable resolutions of 10, 15, 20, 25 or 30µm combined with selectable numbers of x-ray projections (up to 128).

Omron, www.omron247.com/
 

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