VT-S500 has 3D image processing; analyzes topographical features of solder fillets. Is capable of performing solder inspections that mimic IPC guidelines. Software is capable of absorbing production inconsistencies and noise. Provides high-speed inspections and has dual-lane availability. Is available with camera magnifications of 10 or 15µm; is capable of processing PCBs up to 510 x 610mm (single-lane applications) or 510 x 300mm (dual-lane applications).

Omron, www.omron247.com/

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