Buran B100 screen printer has a print format of 75 x 75mm to 508 x 508mm. Repeatability said to be -/±15μm @ 6 Sigma. Cycle time is 12 sec. (without print). Handles PCB of thicknesses ranging from 1 to 6mm. Single lane conveyor. Optical positioning system consists of two high-resolution cameras: 2D inspection system for post-print and stencil bottom-side control. Automatic programmable stencil cleaning system.
Dial-Electrolux, www.DialElectrolux.ru
MX80 pick-and-place system assembles SMT components from 0201 to 35 x 35mm with a full vision, touchless component centering. Pattern recognition system is easy to use. Built-in intelligent vision system enables picking of bulk (loose) components from container-type feeders or trays. Placement area 325 x 500mm. Has 80 feeder slots for 8 mm tapes + 30 sticks of SO8 - Placement rate 4000 cph. Placement accuracy said to be better than 0.08mm, and X/Y resolution is 5 microns. Linear encoders standard. Automatic fiducial correction and bad mark sensing.
Mechatronika, www.Mechatronika.com.pl
M70 fully automatic SMT placement machine assembly offers flexible Feeding options for bulk components. Optical component centering. Optional fully automatic precision dispenser for solder paste and SMD adhesives. For small to medium volume production. Accepts circuit boards up to 350 x 500mm. Places parts ranging from 0201 to 35 x 35mm and 0.5mm pitch. Has 80 sampling positions for 8mm straps. Placement rate 1,500-1,800 cph. X/Y resolution is 10 microns, and placement accuracy is better than 0.1mm.
Mechatronika, www.mechatronika.com.pl
SFX Gang Test Module Kit consists of three basic modules for easy-to-integrate, parallel test or programming of up to 16 or 32 units. Requires one system controller. Can be flexibly adjusted to various environments and different test and programming applications such as flash programming, MCU programming or dynamic tests per Processor Emulation. Consists of three interconnected module types – a TAP transceiver, a multipurpose parallel I/O unit, and a power management unit. For simple system integration, all modules have onboard Mass Interconnect Interfaces from Virginia Panel, and are controlled by a central controller. Supports all modern technologies for Embedded System Access (ESA). In addition to boundary scan, these are Processor Emulation and chip-embedded instruments, for design validation, hardware debugging, production test, programming without probe or nail utilization (non-intrusive). Each site can be individually programmed in several parameters (protocols, voltage, delays etc.).
Goepel, www.goepel.com
ProtoLaser 3D has a large, height-adjustable working platform and a laser optic, which corresponds to ones used in production systems. Is for series-like 3D rapid prototyping and process optimization. Is based on the ProtoLaser concept, where working chamber is housed vibration-decoupled in a compact body.
LPKF, www.lpkf.com
Eexpert 10.6 rework system now comes with the Process Shuttle to streamline flux and solder paste dipping or printing, and pre-positions small surface mountable devices for pickup. Installs on Auto-Vision-Placer (AVP) systems. Features include µSMD Tool, which presents small components with an easy-access fixture, improving processing time. Specific sizes are engineered for optimal pre-alignment. Dipping Tool permits solder spheres on the underside of an area-array device to be coated with a controlled, defined volume of flux or solder paste. Different depths are available to yield specific depositions. Printer Tool permits solder paste or flux to be printed directly onto small components such as quad flat no-leads, enabling immediate placement onto a printed circuit board. Printing stencils can be easily changed to minimize process setup. Transport slide holds various shuttle tools, which feed diverse components to the rework process in a controlled manner.
Retrofits to existing Martin systems that have automated vision placement. Does not require software programming.
Martin, a Finetech Co., www.martin-smt.de