New Products
Aquanox A4727 is has a stable pH and predictable compatibility throughout its long bath life.
LED405Med one-component, LED-curing adhesive meets ISO 10993-5 cytotoxicity requirements for use in medical device assembly.
Sherlock Automated Design Analysis software v. 6.1 has locked IP models and thermal mechanical BGA life predictions.
Master Bond Supreme 11HT-3A two-part, room-temperature curing epoxy is said to have reliable thermal cycling abilities and high-temperature resistance.
MK7 SMT reflow oven incorporates lower delta T, reduced nitrogen consumption and extended PM.
TF Series BGA rework systems include TF1800, designed for standard board sizes of up to 12" x 12", and TF2800 for large, high-mass PCBs up to 24" x 24".
Press Releases
- SIA Applauds CHIPS Act Incentives for Amkor Facility in Arizona
- ASMPT and IBM Deepen Collaboration to Advance Bonding Methods for Chiplet Packages for AI
- Murray Percival Company Expands Product Line with Representation of BIMOS ESD Seating in the Midwest
- Selectronic Assembly Welcomes Eliud Herrera as Production Manager