New Products
ThermoActive Suite Plus software allows operators to use keyboard functions to execute in-process features such as thermal boost, extended soak, skip zone, and temperature averaging.
ULT 200.1 is for removal of laser and soldering fumes, dusts, gases, odors and vapors.
UVCL-P and UVCL-X UV cure coatings feature a single-component, medium-low viscosity, dual-cure coating with secondary moisture cure for cure in shadow areas.
HM520 modular pick-and-place chip mounter is 890mm long and comes with 80,000cph rotary head and 60,000cph piano head, or 72,000cph rotary head for LEDs.
Press Releases
- SIA Applauds CHIPS Act Incentives for Amkor Facility in Arizona
- ASMPT and IBM Deepen Collaboration to Advance Bonding Methods for Chiplet Packages for AI
- Murray Percival Company Expands Product Line with Representation of BIMOS ESD Seating in the Midwest
- Selectronic Assembly Welcomes Eliud Herrera as Production Manager