Sherlock Automated Design Analysis software v. 6.1 has locked IP models and thermal mechanical BGA life predictions.

Master Bond Supreme 11HT-3A two-part, room-temperature curing epoxy is said to have reliable thermal cycling abilities and high-temperature resistance.

MK7 SMT reflow oven incorporates lower delta T, reduced nitrogen consumption and extended PM.

TF Series BGA rework systems include TF1800, designed for standard board sizes of up to 12" x 12", and TF2800 for large, high-mass PCBs up to 24" x 24".