Sigma Line module offers a real-time combination of 3D SPI and 3D AOI measurements.

FH58M FPC connector is 0.25mm pitch.

KY-P3 3D pin inspection now has back-end process AOI capabilities.

Indium8.9HF solder paste is halogen-free, no-clean and has an oxidation barrier said to eliminate head-in-pillow and graping.