New Products
C-Quence is a standardized automated inline concept for heat seal bonding. Includes three modules for alignment, ACF laminating, and final bonding.
Inspect.assembly is an automated visual inspection station for inline assembly verification.
TrueHeight Preforms are engineered with embedded spacer technology said to address all major applications requiring 75µm bondline and above.
Camalot Prodigy dispensing system now comes with optional Dynamic Dual Head (DDH), which doubles dispense speed while maintaining the highest level of accuracy for both dispense pumps.
Master Bond EP3HTSDA-1 is a single-part, no-mix epoxy adhesive designed for die attach applications.
Press Releases
- ASMPT and IBM Deepen Collaboration to Advance Bonding Methods for Chiplet Packages for AI
- Murray Percival Company Expands Product Line with Representation of BIMOS ESD Seating in the Midwest
- Selectronic Assembly Welcomes Eliud Herrera as Production Manager
- SP Manufacturing Holds Milestone Anniversary Celebration