New Products
BH (3.96mm pitch) and BK (5.08mm pitch) series high current board-to-board connectors are available in SMT configuration.
Master Bond EP17HTDA-1 one-component die-attach epoxy can also be used for bonding and sealing.
SPS-2000 solder paste mixer features high-speed mixing capabilities (approx. 1000rpm), resulting in shorter mixing times.
Pyramax convection reflow oven now comes with optional TrueFlat technology, which reportedly ends die tilt. Is designed for substrate thicknesses of 0.15 to 0.30mm.
Sarcon SPG-20A silicone is an easy-to-dispense, low-viscosity compound that exhibits a thermal conductivity of 2.0W/m°K and a thermal resistance of 2.1°K•cm2/W.
Press Releases
- ASMPT and IBM Deepen Collaboration to Advance Bonding Methods for Chiplet Packages for AI
- Murray Percival Company Expands Product Line with Representation of BIMOS ESD Seating in the Midwest
- Selectronic Assembly Welcomes Eliud Herrera as Production Manager
- SP Manufacturing Holds Milestone Anniversary Celebration