New Products
506-03A/B is a two-component 100% solids epoxy encapsulant with a 1:1 volumetric mix ratio.
NS-F851 rosin-based flux for lead-free wave soldering is no-clean and reportedly ensures wetting of all PCB and component substrates for maximum through-hole fill.
SN100CV P608 D4 solder paste is halogen-free, lead-free and no-clean. Unlike silver-containing alloys that derive their strength from a dispersion of fine particles of eutectic Ag3Sn, SN100CV gains its strength from solute atoms in the tin matrix of the joint. Is said to provide excellent wetting and reduce voiding.
Nihon Superior Co.
Press Releases
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Ryder Vietnam - Phase 2: Building resilience and meeting demand
- Scanfil and Etteplan deepen their strategic partnership into production testing