New Products
iSpector JDz 520 bench-top inspection system includes 5mp camera, 15µm telecentric lens, co-axial light and 520 x 460mm max. PCB size.
Master Bond EP13LTE features a low coefficient of thermal expansion of 15-20 x 10-6in/in/°C.
UA-3307-B is an edgebond adhesive that enhances board level reliability in automotive and other harsh environment applications.
Press Releases
- ASYS Group Technology Days 2024: A Record-Breaking Celebration of Innovation
- Bittele Electronics Expands High-Complexity, High-Reliability PCB Assembly Services for the AI Industry
- Absolute EMS Appoints Greg Beck as Director of Sales
- Koh Young Technology Showcasing Advanced Packaging Inspection Solutions at SEMICON Japan at Tokyo Big Sight December 11-13, 2024