New Products
Daisy Chain QFN components with dummy silicon die are for use in a variety of SMT process and thermal profile testing applications.
New generation PF606-P140 Pb-free solder paste and PF606-P245 zero-halogen Pb-free solder paste have wide process windows, superior print and solderability to solve head on pillow issues and improve ICT testability.
New generation SMF-WB51 ultra-low residue liquid flux reportedly has superior spray uniformity, excellent soldering performance, and a wide process window for chip scale and fan-out wafer level -packaging.
Shenmao America
shenmao.com
Register now for PCB West the Silicon Valley's largest PCB industry trade show: pcbwest.com!
Mycronic feeder repair kit for Agilis Flex feeders includes precision-machined aluminum side cover plate and matching barcode.
CircuitShield is an anti-corrosion, waterproofing, and reliability-enhancement nanocoating technology that protects semiconductor devices, printed circuit boards and other electronic components.
Tabletop Shadow Moiré (TTSM) warpage metrology system measures warpage of substrates up to 300mm x 310mm (a 300mm wafer or two JEDEC trays).
Press Releases
- ASMPT and IBM Deepen Collaboration to Advance Bonding Methods for Chiplet Packages for AI
- Murray Percival Company Expands Product Line with Representation of BIMOS ESD Seating in the Midwest
- Selectronic Assembly Welcomes Eliud Herrera as Production Manager
- SP Manufacturing Holds Milestone Anniversary Celebration