Master Bond EP17HTDA-1 one-component die-attach epoxy can also be used for bonding and sealing.
SPS-2000 solder paste mixer features high-speed mixing capabilities (approx. 1000rpm), resulting in shorter mixing times.
Pyramax convection reflow oven now comes with optional TrueFlat technology, which reportedly ends die tilt. Is designed for substrate thicknesses of 0.15 to 0.30mm.
Sarcon SPG-20A silicone is an easy-to-dispense, low-viscosity compound that exhibits a thermal conductivity of 2.0W/m°K and a thermal resistance of 2.1°K•cm2/W.
Complete line of nozzles for Panasonic AM100 machines enable accurate, repeatable, optimized chip placement.