REL22 low Ag SAC solder contains bismuth and melts at about 208°C.

REL61 lead-free solder alloy offers thermal cycling performance for such applications as LED lighting, in-cabin automotive electronics and high power applications. Reliability and performance characteristics equal to or greater than SAC 305 and other low/no-silver solder alloys. Mitigates tin whisker formation. Improves spread, flow and wetting versus low/no-silver alloys. Comes in bar, wire or paste.

AIM Solder

www.aimsolder.com/products/high-reliability-alloys

XPRS  multi-level direct flow inline test handler for assembled PCBs can be tailored based on each product and production process.

Dragonfly 2020 3D printer is for production of multilayer printed circuit boards and 3D circuitry.