Circuits Assembly Online Magazine - New Products

New Products

535-11M-12 UV cured epoxy has been designed to pass rigorous reliability requirements. Eliminates warpage in electronic assemblies and can be used in other bonding applications in fiber optics and camera modules. Can be used for lens bonding, chip encapsulation in smart cards and general bonding applications in photonics assembly. Cures rapidly when exposed to high-intensity UV light. Is a low outgassing, flexible, high-strength epoxy adhesive that does not contain antimony. Is a screen printable version of 535-11M-7 UV cure adhesive.

Engineered Material Systems, www.emsadhesives.com

Multitouch N9041B UXA Signal Analyzer makes continuous sweeps up to 110GHz. Displayed average noise level as low as -150dBm/Hz (>50GHz). Now delivers wider, deeper views of millimeter-wave signals. Characterizes millimeter-wave signals such as 5G, 802.11, satellite, and radar. Max. analysis bandwidth of 5GHz. Provides two input connectors. Dedicated 1.0mm input connector is machined to exact tolerances. A 2.4mm input connector covers measurements up to 50GHz.

Keysight Technologies, www.keysight.com

AXP 2.0 shadow moiré system provides warpage metrology with lateral/top-bottom temperature uniformity. Has optional modules for DIC strain/CTE measurements and DFP for discontinuous surfaces. Uses top and bottom heaters with shadow moiré.

Akrometrix, www.akrometrix.com

MasterSil 973S-LO adhesive, sealant and coating is for use in vacuum environments. This electrically conductive, two-component silicone can be used in aerospace, electronic, optoelectronic and other applications. Features a volume resistivity of 0.004ohm-cm. Is a silver-filled compound that has a thermal conductivity of 9-11 BTU•in/ft²•hr•°F [1.30-1.59 W/(m•K)]. Bonds well to substrates, including metals, composites, glass, ceramics, rubbers, and many types of plastics. Elongation is 50-100%. Serviceability is from -120° to +400°F. Features paste consistency with minimal flow. Offers a variety of cure schedules at elevated temperatures, including 25-45 min. at 250-300°F or 1-2 hrs. at 160-200°F. Passes NASA low outgassing tests.

Master Bond, www.masterbond.com

HMX Hot Melt Jet provides jetting applications under high temperature operation. Dual independent temperature controllers for the jet and melter permit the nozzle to be heated to optimum jetting temperatures. Nozzle and syringe heaters provide jetting temperatures up to 150°C. Reaches speeds up to 200Hz continuously, and jets lines <0.5mm (0.019”) wide. High-temperature diaphragm with tungsten carbide tip and disposable feed tube for easy cleaning and quick syringe exchange. Precision air regulators and gauges permit fine-tuning of jetting parameters. Operates in standalone controller or fully integrated into an automated dispenser. For use in medical, automotive and mobile electronics.

PVA (Precision Valve & Automation), pva.net

Delo-Dot PN3 pneumatic microdispensing valve is said to reduce minimum dispensing amount by a factor of three versus its predecessor, and some products such as unfilled acrylates can be jetted

Delo dot pn3

permanently in amounts as low as 0.009mg. Optimized fluid system geometry permits a maximum dispensing volume of almost 14mg, to cover a large field of applications. Two different piston types, one for very small dispensing amounts and one for small to medium drop sizes. Both configurations provide an operating frequency of up to 330 drops/sec. Eases handling by means of a rotary wheel, which sets the stroke of the piston by selecting one of five different locking positions without any additional tool. Respective position is indicated by an LED, thus making it easier to check the stroke setting, in particular after integration into a production system. Has no open electric contacts and is screwed onto the valve, which facilitates disassembly for cleaning and maintenance.

Delo Industrial Adhesives, www.delo-adhesives.com