Alpha OM-353 is an ultra-fine feature print and air reflow-capable solder paste ideal for assemblies sensitive to component warpage or processes that require cleaning. Has been tested to provide printing performance down to 180µm pad size. Alpha OM-535 is a low-temperature paste with excellent drop shock resistance and electrical reliability for low-temperature reflow applications.  Reportedly produces excellent solder joint and flux residue cosmetics, even when using long/high thermal soaking.

Alpha Assembly Solutions, alphaassembly.com

Prism 800 coating system leverages nozzle-less ultrasonic spray head technology for thin, uniform application of coatings such as photoresists, EMI shield coatings, fuel cell catalysts, and other specialty coatings used in the semiconductor packaging, fuel cell, display, and medical markets. Is designed to meet high throughput production requirements. Features high-speed, fully programmable x-y-z gantry and usable spray area of up to 780 x 780mm. Options include tandem coating heads, two independent liquid delivery systems, dual substrate lift stations, robot load lift/shuttle station, etc.

Ultrasonic Systems, www.ultraspray.com

Flat PCB Trays for work in-process handling hold up to 25 0.12"-thick cards at 0.65" pitch. Are lightweight and sturdy. Flat PCB trays hold up to 25 PCBs of virtually any size for storage and transport at manual workstations. Made of conductive material; temperature rated up to 1,76O°F.

FKN Systek, fknsystek.com

EMS 561-854 conductive adhesive for die-attach applications with small- to medium-size die and tantalum capacitors is designed to cure in one minute at 170ºC. Is stress-absorbing, designed to withstand the rigors of thermal cycling, and features conductive stability. Applicable by pin transfer or needle dispensing.

Engineered Materials Systems, www.emsadhesives.com