New Products
DF40GL series low-profile flexible printed circuit connector supports FPC applications in a small package and operates at USB 3.1 gen 2 speeds up to 10Gbps.
3D•EyeZ sensor system permits measurement of the press-in depth of press-fit connectors mounted on PCBs.
SPS Smart reflow profiler is for thermal process data collection. Collects profile data and compares it to process specifications.
ST 925 combines ST 325 programmable convective/hot air rework station, PH 100 low profile IR preheater and ST 500A Z-axis platform.
Supreme 3HTND-2DM rapid curing, toughened, one-part epoxy is for chip-on-board encapsulation using the dam-and-fill method.
Press Releases
- Scanfil and Etteplan deepen their strategic partnership into production testing
- NOTE receives order worth 132 MSEK and expands collaboration with customer within Security & Defence
- Kitron Strengthens Order Backlog with EUR 11 Million Contract for Defense Communication
- ZTEST Electronics Inc. Announces Transition to the OTCID Market