New Products
Area Ratio Calculator mobile app provides calculations for predicting paste release, solder volumes, and solder paste powder recommendation. Once shape is selected, it takes dimensions of a specific aperture and allows user to select foil thickness. Algorithm displays area ratio, with color identifiers that infer solder paste transfer efficiency. Provides supplemental data such as aspect ratio, solder paste volume, and suggested solder powder type. Free app works for both Android and iOS platform and works on smartphone or tablet.
Beam On Technology, www.beamon.com
tensoRED master tensioning frame is designed to provide a higher and more even tension compared to Alpha Tetra frame. No air pressure on the frame is needed. Reportedly delivers less paste smearing, reduced variation in volume deposits, and improved positional alignment compared to Tetra frames.
Alpha Assembly Solutions, www.AlphaAssembly.com
ProFlow 1K progressive cavity pump is designed to apply small volume lines or dots in applications requiring a high level of volumetric control. Employs auger-like rotor that couples with a rubberized seal to displace fluid with continuous, pulse-free flow. Sealing mechanism provides drip-free operation. Flow rates range from 0.03 - 3.60ml/min, 0.05 - 6.00ml/min, and 0.15 - 18.00ml/min. Each pump has displacement precision of +/-1%, a viscosity range of 1 - 100,000cps and works well with filled or unfilled chemistries. Common applications include thermal grease, epoxy encapsulants, underfill, dam and fill, gasketing, optical display bonding, and single component potting.
PVA, pva.net
Optical modulation analyzer (OMA) software can evaluate multi-channel coherent modulation schemes using a single measurement system. Can calibrate and control multiple OMAs to acquire and analyze simultaneous data from multiple channels such as different wavelengths or fiber cores. Includes visual OMA setup tool that facilitates reconfiguration of oscilloscopes and coherent receiver frontends, so the same hardware can be used for different applications, like PAM4 research or increased channel count in DP-QPSK testing.
Tektronix, www.tek.com
2900 Universal Production Programming System offers fast programming speeds and true universal device support. Programming speed of up to 100MBytes/s for MCUs, eMMC, NAND, NOR and serial flash. Downloads image files up to 25MB/s to all programmers simultaneously. Memory support of 512Gb. Connects up to 15 units in one job session, for high-density volume production. Features 240 pin drivers, to support a range of devices on the same socket. Ultra universal site and socket technology streamlines first-article and production programming. Is compatible with existing 7TH and 8THGEN socket cards and algorithms.
BPM Microsystems, bpmmicro.com/pr
ogrammers/manual-programmers/2900-2/
QuickLink twist-to-lock compression mount connector replaces surface mount connectors that require a receptacle on the PCB. Mounts directly to the PCB with a twist-to-lock footprint design that requires two small through-holes and a gold pad for the connector to land on. Footprints reportedly can be placed anywhere on the board to permit access to any channels from the device without having to solder on SMA or SMP surface mount receptacles. Low loss to 70GHz; meets bandwidth requirements of PAM4 signaling and Ka/Ku band applications. No threading or tools required.
Ardent Concepts, ardentconcepts.com
