GTAz optical head comes on PowerSpector and SpectorBOX AOI machines. Delivers stereoscopic imaging using nine high-speed (90 Fps) cameras operating in full 24-bit color. Image differentials are merged and a vectorized map of the component created, then analyzed based on programmer-applied tolerances. Requires no active light projection, and thus is less costly and compact, for desktop systems. Removes need for capture cards utilizing Thunderbolt2 20GBs transfer speeds and full frame transfer. Views side of components rather than extruded 2D images (as with single-camera systems). Has 3D features such as verification of body height, tilt and coplanarity; and 2D benefits of fast programming and pin height and solder meniscus profile analysis, component presence/absence, polarity, value, angle, offset, color, extra part detection, solder ball detection and short detection. Line-sourced DOAL (direct on axis lighting) coaxial lighting system with high-resolution telecentric optics enables inspection of solder joints without shadow effects from tall components nearby as well as accurate inspection model building. Omnidirectional multi angle, multi-color LED lighting provides optimal illumination regardless of component direction.

Mek (Marantz Electronics), marantz-electronics.com

EMS 561-567 snap cure conductive adhesive is for stringing or shingling applications in crystalline silicon and thin-film solar modules. Is designed to electrically interconnect solar cells using ribbons or direct cell-to-cell contact. Is stress-absorbing, designed to withstand the rigors of thermal cycling, and reportedly features excellent conductive stability to cell and ribbon metallization during damp heat exposure. Cures in seconds at 150°C to 180°C.  

Engineered Material Systems, www.emsadhesives.com

Elpecast Wepesil VU 4675 elastic silicone casting compound features a shore-A-hardness of 30–40 and a high permanent thermal resistance of up to 200°C. Protects and insulates electronic components and assembled PCBs against extreme climatic conditions and aggressive media. Ceramic fillers aid thermal conductivity of approx. 1.2 W/m*K. Suited to applications where heat is to be dissipated rapidly from high power LEDs to a wide area. Gray, solvent-free; resists chemicals and weathering. Classified as hardly flammable due to its chemical characteristics. Removable for repairs. Mixing ratio of 1:1 parts by volume or weight. Cures at room temperature but may be accelerated by heat (e.g., 15 min at 125°C).

Peters, peters.de

Mk 4 XT V precision, flat-panel-based x-ray inspection platform now offers a adjustable isolated monitor arm and console. Improved profile integrates PC within the machine chassis, taking up less space on shop floor. Improved safety and reliability, with compliance to the latest European standards, and with coolant pumps now isolated from the electronics for ease of maintenance and repair. For inspection of complex printed circuit boards and electronic components.

Nikon Metrology, www.nikonmetrology.com