New Products
Mycronic feeder repair kit for Agilis Flex feeders includes precision-machined aluminum side cover plate and matching barcode.
CircuitShield is an anti-corrosion, waterproofing, and reliability-enhancement nanocoating technology that protects semiconductor devices, printed circuit boards and other electronic components.
Tabletop Shadow Moiré (TTSM) warpage metrology system measures warpage of substrates up to 300mm x 310mm (a 300mm wafer or two JEDEC trays).
FH64MA series compact flexible printed circuit (FPC) connector offers a profile of 0.5mm with 0.25mm pitch and depth of 3.15mm when locked.
EP41S-F two-part epoxy for bonding, sealing, coating and encapsulation applications combines ambient temperature cure speed with chemical resistance and superior electrical insulation properties.
Press Releases
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Ryder Vietnam - Phase 2: Building resilience and meeting demand
- Scanfil and Etteplan deepen their strategic partnership into production testing