Fujipoly’s Sarcon 30XR-Um thin film is a putty-like thermal gap filler pad. Exhibits thermal conductivity of 17 watt/m-k and a thermal resistance of 0.02 °Cin²/W. Can be compressed quickly using low compression force. The 0.3mm thin film is available in sheets up to 50 x 50mm. Can be cut to custom lengths or die-cut to fit exact shape of heat-generating components. Complies with UL 94 V-0 flame retardancy specifications and is most commonly used to transfer heat from medium to high-power CPUs and semiconductors to nearby heat sinks.

Fujipoly America, www.fujipoly.com

Viper step stencil has an improved printing surface, reportedly with no variance in surface finishes.

ProFlow 2K dual component dispenser applies small volumes of two-part adhesives in lines or dots with a high level of control.

Vigon PE 190A PCB and power electronics defluxing agent is an aqueous-based, alkaline cleaning agent. Is based on MPC technology developed for use in spray-in-air equipment. Removes oxidation and stains from copper surfaces, while ensuring material compatibility in preparation for subsequent processes, such as wire/adhesive bonding and molding.

Zestron, www.zestron.com