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New Products

Max-1200 coating system leverages nozzle-less ultrasonic spray head for thin, uniform application of coatings, such as anti-reflective, CdCl2, anti-smudge, adhesion promoters and other specialty coatings used in the solar, lens and display markets. Is designed to meet high throughput production requirements. Features programmable high-speed X-Y-Z gantry to process glass plates or other substrates up to 1.2m wide at a process speed of up to 3.3m per min. Employs bidirectional coating application sequence that provides an ultra-uniform coating layer onto the substrate.

Ultrasonic Systems, www.ultraspray.com

 

Alpha OM-353 is an ultra-fine feature print and air reflow-capable solder paste ideal for assemblies sensitive to component warpage or processes that require cleaning. Has been tested to provide printing performance down to 180µm pad size. Alpha OM-535 is a low-temperature paste with excellent drop shock resistance and electrical reliability for low-temperature reflow applications.  Reportedly produces excellent solder joint and flux residue cosmetics, even when using long/high thermal soaking.

Alpha Assembly Solutions, alphaassembly.com

 

Prism 800 coating system leverages nozzle-less ultrasonic spray head technology for thin, uniform application of coatings such as photoresists, EMI shield coatings, fuel cell catalysts, and other specialty coatings used in the semiconductor packaging, fuel cell, display, and medical markets. Is designed to meet high throughput production requirements. Features high-speed, fully programmable x-y-z gantry and usable spray area of up to 780 x 780mm. Options include tandem coating heads, two independent liquid delivery systems, dual substrate lift stations, robot load lift/shuttle station, etc.

Ultrasonic Systems, www.ultraspray.com

 

Flat PCB Trays for work in-process handling hold up to 25 0.12"-thick cards at 0.65" pitch. Are lightweight and sturdy. Flat PCB trays hold up to 25 PCBs of virtually any size for storage and transport at manual workstations. Made of conductive material; temperature rated up to 1,76O°F.

FKN Systek, fknsystek.com

EMS 561-854 conductive adhesive for die-attach applications with small- to medium-size die and tantalum capacitors is designed to cure in one minute at 170ºC. Is stress-absorbing, designed to withstand the rigors of thermal cycling, and features conductive stability. Applicable by pin transfer or needle dispensing.

Engineered Materials Systems, www.emsadhesives.com

SF855-LR soldering flux is a low-solid, low-residue, no-clean, non-rosin organic flux designed for use in tabber and stringer equipment of PV through soldering tabs to cell contacts. Low solids content (1.6%) and nature of activator system reportedly result in nearly no residue left on cell after soldering. Wide operating window and temperature range; can be used in SnPb, SnAgPb and Pb-free applications.

Kester, www.kester.com

 

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