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New Products

Aqube HY7 hybrid cleaning system is pre-equipped for extended water management and is smart factory ready.

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CircuitShield anti-corrosion and waterproofing coating contains a novel chemical plasma coating that replaces traditional encapsulants and coatings.

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SMF-WC52 ultra tacky flux is applied in flip-chip dipping process.

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Daisy Chain QFN components with dummy silicon die are for use in a variety of SMT process and thermal profile testing applications.

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New generation PF606-P140 Pb-free solder paste and PF606-P245 zero-halogen Pb-free solder paste have wide process windows, superior print and solderability to solve head on pillow issues and improve ICT testability.

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New generation SMF-WB51 ultra-low residue liquid flux reportedly has superior spray uniformity, excellent soldering performance, and a wide process window for chip scale and fan-out wafer level -packaging.

Shenmao America
shenmao.com


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