New Products
Delta Bond optical bonding system dispenses adhesives for display devices in atmosphere, reportedly without bubbles. Is said to be for use with any optically clear adhesive, including acrylics, silicone, and epoxy. Is used for touch screen to LCD and cover glass to LCD. Can include fill dispensing, cover placement, and fluid-flow vision. Employs a gantry system featuring precision ball screw slides driven by brushless DC servo motors. Every axis of motion features optical encoder feedback. UV cure permits full area cure in place while robotically positioned.
PVA, www.pva.net
535-11M-12 UV cured epoxy has been designed to pass rigorous reliability requirements. Eliminates warpage in electronic assemblies and can be used in other bonding applications in fiber optics and camera modules. Can be used for lens bonding, chip encapsulation in smart cards and general bonding applications in photonics assembly. Cures rapidly when exposed to high-intensity UV light. Is a low outgassing, flexible, high-strength epoxy adhesive that does not contain antimony. Is a screen printable version of 535-11M-7 UV cure adhesive.
Engineered Material Systems, www.emsadhesives.com
Multitouch N9041B UXA Signal Analyzer makes continuous sweeps up to 110GHz. Displayed average noise level as low as -150dBm/Hz (>50GHz). Now delivers wider, deeper views of millimeter-wave signals. Characterizes millimeter-wave signals such as 5G, 802.11, satellite, and radar. Max. analysis bandwidth of 5GHz. Provides two input connectors. Dedicated 1.0mm input connector is machined to exact tolerances. A 2.4mm input connector covers measurements up to 50GHz.
Keysight Technologies, www.keysight.com
AXP 2.0 shadow moiré system provides warpage metrology with lateral/top-bottom temperature uniformity. Has optional modules for DIC strain/CTE measurements and DFP for discontinuous surfaces. Uses top and bottom heaters with shadow moiré.
Akrometrix, www.akrometrix.com
MasterSil 973S-LO adhesive, sealant and coating is for use in vacuum environments. This electrically conductive, two-component silicone can be used in aerospace, electronic, optoelectronic and other applications. Features a volume resistivity of 0.004ohm-cm. Is a silver-filled compound that has a thermal conductivity of 9-11 BTU•in/ft²•hr•°F [1.30-1.59 W/(m•K)]. Bonds well to substrates, including metals, composites, glass, ceramics, rubbers, and many types of plastics. Elongation is 50-100%. Serviceability is from -120° to +400°F. Features paste consistency with minimal flow. Offers a variety of cure schedules at elevated temperatures, including 25-45 min. at 250-300°F or 1-2 hrs. at 160-200°F. Passes NASA low outgassing tests.
Master Bond, www.masterbond.com
HMX Hot Melt Jet provides jetting applications under high temperature operation. Dual independent temperature controllers for the jet and melter permit the nozzle to be heated to optimum jetting temperatures. Nozzle and syringe heaters provide jetting temperatures up to 150°C. Reaches speeds up to 200Hz continuously, and jets lines <0.5mm (0.019”) wide. High-temperature diaphragm with tungsten carbide tip and disposable feed tube for easy cleaning and quick syringe exchange. Precision air regulators and gauges permit fine-tuning of jetting parameters. Operates in standalone controller or fully integrated into an automated dispenser. For use in medical, automotive and mobile electronics.
PVA (Precision Valve & Automation), pva.net
