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New Products

EcoSonic ESD Paper is a static-dissipative, corrosion-inhibiting packaging paper for electrical and electronic items.

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5R9-355 temperature controller (Peltier Effect) has a complete mechanical enclosure with mounting holes, user-friendly keypad menu selections and a vivid LCD display. Offers temperature resolution of 0.01°C and control stability of ± 0.1°C. Designed for applications needing a temperature control range of -40° to 250°C. Operationally the same as 5R9-350 model.

Oven Industries, ovenind.com

Mezza-pede SMT connectors now include a lower profile DHAL header that reportedly reduces board stack height by 15%. Features 0.025" insulator. When paired with mating socket model DHS, a z-axis stack height of 0.132" is achievable. Facilitates a reduction in package height and a shorter signal path in applications ranging from tunable laser power connectors in optical transceivers to handheld medical electronics. For use in 1mm pitch board-to-board and cable-to-board interconnections in high-density electronic designs. DHAL is available with 14 positions and features SMT lead frame and pin design that combines high-reliability screw-machined terminals with over-molded lead frame in a precision-molded LCP insulator. Is RoHS compliant, usable at operating temperatures from -55° to +125°C; can handle up to 1.1A current at 80°C.

Advanced Interconnections Corp., www.advanced.com

 

EP46HT-2AO Black two-component epoxy blends thermal stability with a high strength profile for a variety of bonding, sealing and encapsulation applications.

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Elite Series inline selective soldering systems have interchangeable modules that can mix and match inline flux and preheat modules.

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The HWTREK Project Development Hub update adds cloud-based collaboration features to improve IoT manufacturing supply chain visibility and transparency and increase efficiency. Integrates professional network (expert ecosystem community) and productivity software (collaboration tools). Collaboration tools connect hardware developers and the supply chain, other resources, and services for the lifecycle of a product. New collaboration features include group-based problem solving and task management; a to-do list that collects messages in need of urgent attention; contact list that tracks partners and team members, frequent contacts, and potential collaborators; work stored in a central location, and document timestamping.

HWTrek, www.hwtrek.com

 

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