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New Products

AdvantisV leverages technologies of the Fuzion platform.

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VersaFlex-Ultra selective solder module features two solder pots, either y- and x-variable or z-variable, equipped with different solder and different solder nozzles.

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X7056-II inline automatic 3D X-ray inspection machine features a new handling concept called xFastFlow for printed circuit boards change in as few as 4 sec.

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E-Z Step stepped stencils are used to facilitate an increase or decrease of paste volume and deposit height on selected printed circuit board areas with mixed component technology, large ground pads, intrusive reflow or coplanarity issues. Step areas are 20 to 150µm with support of complex shapes. Step ramp is in 50µm increments. Positional accuracy is <10µm on step areas. Material thickness is +/-2%.

MET Stencil
www.metstencil.com

 

BSX series BERTScope is 32Gb/s protocol-aware bit error rate test and analysis system. Helps characterize receiver in Gen3 and Gen4 devices. Can shorten time needed to debug link training and bit error rate issues. Provides tools and flexibility to visualize and control handshaking and link training process for devices. Is available with maximum data rates of 12.5Gb/s, 24Gb/s and 32Gb/s. Includes tools that automate compliance testing. Has built-in Tx equalization, reference clock multiplication, and interference generation.

Tektronix
www.tek.com

 

The accessory kit for Jumbo Elephant extraction and ionization unit includes test and measurement devices, as well as cleaning tools. Ion Check Set includes a functional tester for ionization systems (ion check) and a measuring probe for high-voltage power supply check (ion check test probe). Also has field intensity meter for measuring electrostatic charges on material surfaces (ELFI I) and a cleaning kit, consisting of 0.5l cleaning agent and a brush.

ULT
www.ult.de

 

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