Automated die attach tilt metrology is a new feature for shadow moiré or DFP systems (AXPs). Allows users to measure tilt angle of the bottom substrate to a mounted die/component/daughter board. Is embedded into existing Studio software platform to allow customers to automatically measure both warpage metrology and die attach tilt metrology on a variety of substrates. Measurements can be conducted pre-reflow at various temperature profiles during reflow and during reflow cooldown to examine effects die placement and temperature have on mating angle. Complete measurement of warpage and die attach tilt takes less than 2 sec. per measurement point along the temperature profile.

Akrometrix, www.akrometrix.com  

LTS300-Jedec molten solder lead tinning system consists of two dynamic nitrogen inerted solder pots, a dynamic flat wave fluxing station, forced convection preheating, aqueous wash and drying stations, plus a Jedec tray stacker, forming a complete component re-tinning work cell. Fully integrated vision system consists of top and bottom viewing cameras for accurate alignment of components prior to re-tinning. Vision system also performs post-tinning inspection to detect potential solder bridges before placing components back on tray. Fully configured system is capable of performing a molten solder component lead tinning process for gold removal and re-tinning of components for Class 2 and Class 3 applications in compliance with new J-STD-001F requirements.

ACE Production Technologies, ace-protech.com

Sensitive Wire Feed is a process-reliable handling technology for reproducible solder joints with wire-guided processes. Involves a feed module that can be freely integrated and used for all applications in assembly and interconnection technology and can be combined with different process modules. Helps ensure reproducibility and process reliability during piston and laser soldering. For applying a specific amount of solder when piston, laser, or induction soldering.

Works by feeding wires to process surfaces in a path- and force-monitored manner. The wire's impact force can thus be defined. Wire feed is stopped when this is achieved. Both feed and withdrawal of wire are monitored. Wire kinking is avoided using this function; component and handling tolerances are compensated or detected. Reference points are likewise specified here in order to be able to transport controlled, reproducible amounts of wire. Wire-reel holder is aligned flexibly so that various wire-reel positions as well as reel diameters can be used in the shortest possible time. Work angle can be freely selected. Wire is stably introduced into soldering process in a regulated manner using intelligent sensor technology. C6 controller records all process steps, enabling 100% data capture.

Eutect, eutect.de

Sigma F8S component placement machine delivers an average 5% improvement in productivity (takt time) over previous F8 models and is more durable. Features improved x-y axis using new linear motor technology, and achieves lower vibration through weight reduction and adoption of cancellation-type linear motors.

Yamaha Motor IM, visit www.yamaha-motor-im.com