NPM-VF is a dual-gantry, multi-head, odd-form placement and insertion machine. Achieves 4,500cph throughput within narrow footprint of a compact SMT mounter. Standard vacuum nozzle handles a gamut of packages and three additional process heads available for components up to 130x35mm and 60mm tall, requiring 100N force (nearly 22.5 lbf). Has a body chuck for gripping large odd-form devices without a pick surface (e.g., power transformers), lead chuck for gripping through-hole devices (e.g., electrolytic capacitors), and swing nozzle for inserting through-hole devices oriented in packaging other than insertion orientation. Tenders myriad feeder types from bowl feeders to stackable stick, through-hole, vacuum-formed/JEDEC trays, and tape feeders up to 104mm. Active clinch system secures various through-hole lead diameters at multiple rotations. When not required, clinch doubles as localized board support for snap-in/press-fit components.

Panasonic Factory Solutions Company of America, www.panasonicfa.com

Register now for PCB West, the Silicon Valley's largest trade show for the printed circuit industry, taking place Sept. 13-15 in Santa Clara: pcbwest.com

TF 1800 BGA/SMD rework system incorporates top-side inductive-convection heater, which provides rapid heat-up and active cooling of solder joints. Inductive-convection technology allows for an active cooling feature, which provides controlled component/PCB cool down directly through the nozzle. High-efficiency, low thermal mass design reportedly takes less power to operate and is more reliable than conventional heaters. Stepper motor drives automated reflow head. Has 28µm (0.0011”) placement accuracy. Vacuum pick/shaft design with optical sensor is counterweight balanced. Includes adjustable height bottom-side IR preheater. Other features include HD vision overlay system for optical alignment with quad-field imaging capability for placement of outsized BGAs or large fine-pitch QFPs and an integrated underside board support wand to prevent warping during reflow.

Pace Worldwide

paceworldwide.com

Vigon N 680 pH neutral defluxing agent targests low-standoff component cleanliness. Developed for use in spray-in-air inline and batch equipment. Is based on micro phase cleaning technology and is aqueous-based. Removes range of electronic assembly flux residues. Reportedly provides excellent material compatibility, particularly with sensitive metals such as copper.  

Zestron, www.zestron.com

Register now for PCB West, the Silicon Valley's largest trade show for the printed circuit industry, taking place Sept. 13-15 in Santa Clara: PCBWEST.COM

ThermoActive Suite Plus dynamic profile software is for rework process control. Is capable of self-adjusting thermal output to reach safe reflow temperatures automatically. In Auto Profile Mode, software responds by increasing or decreasing top heat relative to the environment, ramp rate and temperature limits. Has six general profiles; automatically adjusts wattage required to achieve high-yield small, medium and large PCB rework. Features precision targeting of visible focused IR. Doesn’t induce laminar hot air flow or heat migration issues with adjacent components. Eliminates touchup rework. Precisely measures and controls actual IC temperature. Senses and reacts to component temperature vs. heater core temperature. Displays solder sphere temperature, time above liquidus, and overlays multiple data points. Has component placement accuracy of 5µm. Incorporates parallax reduction 1" cube technology.

PDR Americas, pdr-rework.com

Register now for PCB West, the Silicon Valley's largest trade show for the printed circuit industry, taking place Sept. 13-15 in Santa Clara: PCBWEST.COM