781Mini Series low volume, low pressure spray valve reportedly directs nozzle air pressure with greater accuracy for improved spray pattern uniformity and edge definition. Precision spray control makes it ideal for applications of low-to-medium viscosity fluids. Reportedly has a 60% smaller form factor than conventional spray valves. Dispenses fluids in tighter spaces and onto smaller, more complex surfaces, with area coverage as small as 1mm wide. Includes a quick release clasp and 360° rotational fluid body.

Nordson EFD, www.nordsonefd.com

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SN100CV P506 D4 lead-free, no-clean solder paste enables thermally stable solder joints after thermal cycling. Gains its strength from solute atoms in the tin matrix of the joint. Survives long-term storage at room temperature. Meets requirements of reflow soldering processes.

Nihon Superior Co., www.nihonsuperior.co.jp/english

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Spider jet dispenser features dispensing capability up to 150,000 dots/hr. (with piezo jet valve) and accommodates boards up to 406 x 305mm. Provides laser height mapping; offers compensation for substrate warp/3D applications. Has two valves. Requires 1m² of production floor space. Places dots within 50µm @ 3σ at full speed. Includes three jet speed options. Jet valve: 150,000 dots/hr.; pneumatic jet valve: 80,000 dots/hr.; time/pressure valve: 28,000 dots/hr.; Archimedean screw: 24,000 dots/hr.

Essemtec, www.essemtec-usa.com

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Master Bond EP21TDCN-LO is an electrically conductive two-component adhesive/sealant effective for grounding, shielding and static dissipation applications. Is capable of withstanding rigorous thermal cycling, mechanical vibration and shock. Passes ASTM E595 tests for NASA low outgassing. Features a nickel filler. Has a volume resistivity of 5-10 ohm-cm and a thermal conductivity of 11 BTU•in/ft²•hr•°F [1.59 W/(m·K)]. Bonds well to metals, composites, ceramics and many plastics. Has tensile lap shear, tensile and T-peel strength of 1,400-1,600 psi, 3,000-4,000 psi and 15-20 pli, respectively. Resists exposure fuels, oils, organic solvents and water. Optimum cure is overnight at room temperature, followed by two to three hours at 150-200°F. Is serviceable from -100°F to +275°F. Is available for use in ½ pint, pint, quart, gallon and 5 gallon container kits. Has a shelf life of six months at ambient temperatures in original, unopened containers.

Master Bond, www.masterbond.com

Register now for PCB West, the Silicon Valley's largest trade show for the printed circuit industry, taking place Sept. 13-15 in Santa Clara: PCBWEST.COM