No. 963 is a 250°F, electrically-heated, vertical conveyor oven currently used for curing epoxy.  Workspace dimensions measure 30” x 65” x 83”. 30 kW are installed in Incoloy-sheathed tubular elements to heat the oven chamber, while a 6000 CFM, 5-HP recirculating blower provides vertical upward airflow to the workload. Features 4” insulated walls, aluminized steel exterior and interior, top-mounted heat chamber, two independent doors, and 25 product trays, each 24” x 6”, supported by roller chain and driven by a ¾ HP drive motor, controlled by a variable frequency drive. Controls include a digital indicating temperature controller, recirculating blower airflow safety switch, manual reset excess temperature controller with separate contactors, and a tower light to indicate machine status. Is built to JIC/NEMA 12 electrical standards.  

The Grieve Corp., www.grievecorp.com

Considus dry storage system offers protection for sensitive components and assemblies. Is used when storage under defined conditions of humidity or active component drying is required. Can be used for electronic components, partially assembled electronic modules, printed circuit boards, foils, wafers and components with oxidation-sensitive surfaces. Three dehumidification technologies are available:  adsorption dehumidification; nitrogen dehumidification, and compressed-air dehumidification.  Achieves <3% relative humidity less than one minute after door closed. Allows humidity-sensitive components in accordance with IPC/JEDEC-STD-033 to be stored indefinitely.

Asys Group, http://www.asys.de/agweb/america/press-release/considus

McDry HM-1002BN nitrogen auto-flow dry cabinet has a low-power mode. Reportedly uses less nitrogen compared to standard N2 cabinets because of high-performance drying units. Enables quick recovery when opening and closing doors. Offers high-quality build and ESD specifications.

McDry, www.mcdry.eu/english/

Seika Machinery, www.seikausa.com

Sarcon SG-26SL is a thermally conductive and electrically non-conductive silicone-based compound that has a thermal conductivity of 2.6W/m°K when dispensed between a component (such as a CPU or power converter) and a heat sink. Is for thin bond line applications. Removable by wiping with a cloth. Reportedly delivers consistent performance across temperatures ranging from -55°C to 205°C. Packaging options include prefilled syringes and bulk jars for manual or automated dispensing applications.

Fujipoly America, www.Fujipoly.com