PSV5000 automated programming system combines programming technology with intelligent system integration. Includes pick-and-place technology and vision system for precise alignment and placement. Supports integrated fiber laser marking. Rated for delivering up to 1300 parts per hour.  

Supports all device types, including FPGAs, CPLDs, microcontrollers and flash memories (including serial flash, eMMC, NAND and NOR devices) with tape and tray configurations with up to 6 programmers (24 individual sockets) in a compact footprint. Supports Serial Number Server software. 

Data I/O, dataio.com/PSV5000 

P-series, for atomic layer deposition of thin-film coatings, uses sequential, self-limiting and surface-controlled gas phase chemical reactions to apply ultrathin, uniform conformal coatings on printed circuit boards. Is production-scalable. Is said to deposit a dense, tight, uniform conformal coating.

Picosun, www.picosun.com

M8 no-clean solder paste, for high-density electronics assemblies, has been developed in combination with T4 and finer mesh Pb-free alloy powders. Reportedly provides stable transfer efficiencies. Novel activator system provides durable wetting action accommodating a range of profiling processes and techniques. Reportedly eliminates HiP defects on BGAs and reduced voiding on QFN/BTC components. Based on NC258 platform.

AIM Solder, www.aimsolder.com

Updated XJTAG software reportedly increases flexibility for easier access to JTAG capabilities of boards and maximum test coverage. Dynamic chain profiling helps initialize boards with multiple JTAG chains, in which a device in one JTAG chain controls power supplies or reset lines for JTAG devices in other chains. During flash programming, can be set up to clock only JTAG data through the chain needed for programming operation. Can remove need to clock hundreds of bits of data per scan; speeds testing/programming. Increases capabilities of XJLink2 JTAG controller.

XJTAG, www.xjtag.com