New Products
THT-Line AOI for double-sided inspection of plated through-hole assemblies now comes with tape transport in addition to roller conveyor for work piece carriers. Inspects selective solder joints on assemblies transported without work piece carrier. Can be used both for actual manufacturing process in the upper area of the system as well as return transport in lower area of the machine. Also has laser measuring system for coplanarity control (e.g., for connectors) or for height measurements on various components. Up to two different and independently operating AOI modules can be integrated into a single system chassis.
Goepel Electronics, www.goepel.com
EMS 618-15 is a room temperature cure two-part conductive adhesive for printed circuit board assembly applications. Is said to cure in 24 hr. at room temperature or rapidly at elevated temperatures. Has a 10-to-1 mix ratio and comes in a two syringe package designed for use with static mix heads. Forms high-strength, high-reliability conductive interconnects.
Engineered Material Systems, www.emsadhesives.com
Unix FS flash soldering series has a speed upgrade with an integrated optical laser configuration; is reportedly two times faster than a typical laser. Can integrate pre- and post-soldering processes such as surface mount and through-hole devices. Depending on conditions, 100 points can be soldered in fewer than 30 sec. at <0.25 sec./point. Integrates soldering process for solder paste and wire; has a coaxial camera that follows soldering work scenes. Soon will feature automatic correction and error detection. Is possible to integrate pre- and post-soldering.
Japan Unix, www.japanunix.com
ACT100Lite automatic wet scrubber for metal masks used in solder printing is said to reduce costs and space requirements by limiting metal masks’ size to small. Uses a novel small-area scrubbing method. Scrubbing and drying occur inside scrubber, eliminating contact with solvent and exposure to airborne cleaning solution for operator safety. The simple configuration minimizes maintenance costs and the need to replace consumables.
OKI Communication Systems, http://www.oki.com
TC-3040 thermally conductive gel is a thermal interface material (TIM-1) developed with the help of IBM. Reportedly offers more reliable
thermal management, reduced stress and excellent under-die coverage for flip chip applications. Is said to deliver nearly two times the thermal performance of other industry standard TIMs, as well as high thermal conductivity targeting 4W/mK with reliability. Offers broader design options for high-performing, reliable ICs.
Dow Corning, www.dowcorning.com
Multi-ɸ variable laser spot diameter system optimizes laser exposure diameters to fit any component size or board patterns. Laser beam spot diameters are adjustable without moving. Beam spot diameters adjustable within 0.1-3.0mm. Diameter range determined by optical fibers and lens configuration. Variable spot diameters accommodate diverse component shapes and land patterns. New feeding mechanism feeds solder wire from any direction. Mixed-component assembly PCBs now can be processed with just one machine. Replacement laser heads are now available for existing laser soldering customers.
Japan Unix, www.japanunix.com/en/products/laser/multi-phi.php
