N100 PCB Nibbler is for singulating tab routed printed circuit boards. Tabs are cut by placing them under a blade and stepping on a foot pedal. 100 Psi factory air is needed. Excess material from the tab is stored inside a compartment of the tool and can be removed. Blades come in a variety of tab sizes and routing thicknesses. Standard blade thicknesses are 0.062", 0.093" and 0.120". Custom sizes can be requested. For low- to medium-volume production quantities.

FKN Systek, www.fknsystek.com

Fineplacer Sigma semiautomated die bonder is for large die up to 100mm, combined with a working area of 450 x 300high-density array applications and high bond force (up to 1000N) requirements. Handles a wide variety of wafer-level packaging (FOWLP, W2W, C2W) with high bump count used to assemble MEMS/MOEMS, IR/ image sensors, focal plane arrays, and high power device packaging, including assembly of 2.5D and 3D IC packages. Also can pick up from and bond to 300mm wafers. Vision alignment system provides high resolution at all magnification levels and real-time optimized camera images. Touch screen magnifiers allow zoomed images anywhere in the field of view. Two high definition cameras and specially developed optics ensure that the cameras' full resolution potential is tapped. Features pattern recognition.

Finetech USA, www.finetechusa.com

No. 988 is an electrically-heated, 650°F top-loading batch oven used to process electronic components. Workspace dimensions measure 12' x 1' D x 1' H. 15KW are installed in Incoloy-sheathed tubular heating elements to heat the unit, while a 600 cfm, 1/2-hp recirculating blower provides back-to-front horizontal airflow to the workload. Features 6" insulated walls, aluminized steel exterior, Type 304 stainless steel interior, a manual, counterweighted rear-hinged door, workspace floor reinforced for 100lb. loading, access door at each end of the oven, plus swivel casters with swivel locks and wheel brakes. Controls include a digital programming temperature controller, manual reset excess temperature controller with separate contactors and recirculating blower airflow safety switch.               

The Grieve Corp., www.grievecorp.com

C2A-06-G1350-120 rectangular rosette gage and C2A-06-015LW-120 uniaxial linear gage are designed for precise, stable, and reliable stress analysis of printed circuit boards. Detect PCB surface strains at critical locations in consumer electronics. C2A-06-G1350-120 is a stacked rosette gage with a 5mm diameter matrix and 3m of three-conductor cable to eliminate lead wire soldering after bonding. Advanced Sensors strain gage technology reportedly makes smaller planar rosettes possible for use in surface mounting applications with restricted areas, as well as for intra-laminar strain measurement. C2A-06-015LW-120 is supplied with pre-attached cables; features active grid length of 0.015" and an overall matrix of 1.4 x 1.9mm. For installation on surface mount components.

Micro-Measurements, www.micro-measurements.com