Q-upAuto quality control system links component mounters and inspection equipment and integrates the information they produce. Simplifies quality control of the entire PCB-mounting line, which conventionally has required highly expert knowledge and enormous working hours, thus contributing to defect prevention and enhanced productivity. Upgrades defect analysis platform from Q-upNavi Series; identifies defect causes among multiple factors and extract optimal setting conditions (parameters) for individual facilities, based on final quality inspection. Links quantitative inspection results to information on operation of component mounters to identify defect causes in multiple processes including printing, placement and reflow.

Omron, omron.com

Surface-Cure Thermal Paste is stable during thermal shock testing. Fills gaps that naturally exist between two metal surfaces placed one upon the other, improving the effective range of surface area for heat transfer. Does not set. Remains malleable when rework of components is required. Resists pump-out of the thermal interface layer from the bond line, ensuring minimal degradation of effective heat dissipation. For applications that are exposed to rapid and frequent changes in temperature. Thermally stable up to 200⁰C. Applicable using conventional industrial dispensing equipment and can also be applied via screen/stencil printing directly onto the contact surfaces. Contains no solvents and can be applied to very thin films.

Electrolube, electrolube.com

BGA Solder Spheres for PBGA, CBGA, TBGA, CSP and flip chip assemblies are made using ultra micron technology from highly pure metals. Alloy compositions made using piezoelectric droplet jet technology for accurate diameter uniformity, bright shiny surface finishes and sphericity. Come in diameters of 0.75, 0.6, 0.5, 0.45, 0.3, 0.25, 0.1, 0.08, 0.07, 0.06 and 0.05mm.

Shenmao America, shenmao.com

EP3HTS-LO is a single-component epoxy for bonding, sealing and coating applications. Features silver filler; is electrically conductive with a resistivity of less than 0.001 ohm-cm. Has thermal conductivity of 12-15 BTU•in/(ft²•hr•°F). Is dimensionally stable and bonds well to metals, glass, composites, ceramics and many plastics. Withstands chemicals such as water, oils, fuels and cleaning agents. Is serviceable over the temperature range of -60°F to +400°F. Offers handling with no mixing and an unlimited working life at room temperature. Cure schedule is 45 to 50 min. at 250°F or 20 to 30 min. at 300°F. Passes ASTM E595 tests for NASA low outgassing. Is suited for use in the aerospace, electronics, microelectronics and optical industries.

Master Bond, www.masterbond.com