New Products
MasterSil 930 fluorosilicone is for bonding, sealing and coating. Is a one-part system able to withstand exposure to water, fuels, oils, greases, refrigerants, acids, bases and solvents. Has a paste viscosity and has a tack-free time of 20 to 30 min. Tensile strength 800 to 1,100 psi. Reportedly bonds well to metals, composites, ceramics, glass, rubbers, plastics and other silicones. Hardness rating 30 to 40 Shore A. Is electrically insulative and has a volume resistivity of more than 1014 ohm-cm. Service temperature range is -85° to +450°F. Comes in 80g tubes.
Master Bond, www.masterbond.com
Axium series feeders automatically place labels using existing pick-and-place equipment. Now includes adjustable presentation speed modes and Generic Media Platform label module that enables adjustments for label changeover, for increased flexibility. Combined with auto-apply labels, improves placement accuracy and process speed. Presents label like any other SMT component.
Identco, identco.com
X-Line 3D inline AXI now comes “X40 Plus” for 3D inspection speed increase of up to 18%. Optimized imaging chain in combination with an improved axle system and faster execution of test algorithms results in cycle time savings, depending on maximum resolution and board dimensions. A 216 x 164mm assembly with more than 8,000 solder joints requires about 40 sec. for complete 3D X-ray inspection. For double-sided boards; captures top and bottom sides within a single pass. Based on a real time multi-angle image, recording a complete 3D inspection of the assembly is possible. Integrated reconstruction methods based on digital thomosynthesis enables the defined evaluation of individual layers of the circuit board under test.
Goepel Electronics, www.goepel.com 
VisualCAM Stencils v. 16.7 design tool streamlines and automates stencil/paste designs generation. New release defines paste shapes using pitch rules. Features enhanced library management, improved identification and shape assignments, and improved paste generation and reporting. Includes many new macro commands and a powerful macro developer to aid in automation, data preparation and stencil generation.
Wise Software Solutions, wssi.com
Register now for PCB West, the Silicon Valley's largest trade show for printed circuit board design, fabrication and assembly: Sept. 15-17 at the Santa Clara Convention Center pcbwest.com
NexJet NJ-8 dispenser features ReadiSet two-piece jet cartridge which is quickly and easily removed, cleaned, inspected, and reinstalled without tools. Is said to be long-lasting, durable and has been tested on many fluids, from high-viscosity silicones to low-viscosity reagents, in board-level underfill, chip-scale packaging, ball grid array, package-on-package underfill, precise coating, silicone jetting, and adhesive dispensing applications. Only parts that come in contact with fluid have to be removed from system for cleaning and maintenance. Reportedly saves fluid, resources, time, and cost of cleaning; produces clean dispensing environment. Patented software manages dispensing process, controlling fluid velocity, adjusting dot sizes, regulating amount of fluid dispensed, and compensating for fluid viscosity changes to center the process window.
Nordson ASYMTEK, www.nordsonasymtek.com/nexjet
IC-M12S-CXP monochrome 12Mp MCMOS camera has a CoaXPress CXP6, DIN-4 interface delivering 181fps. Is based on the CMOSIS CMV12000 v2 high-sensitivity CMOS sensor and replaces the discontinued IC-X12CXP. Size and weight reduced to a 80 x 80 x 36.55mm and 400g without lens mount. All-new housing design uses newly developed sensor positioning design for precise alignment. Addition of LM-Mount to already large lens mount allows use of Leica-M and Zeiss ZM lenses. DSNU/PRNU correction algorithms completely redesigned for improved image quality while still allowing custom calibration. User definable ROI (H&V), exposure delay and strobe output delay.
ISVI Corp., isvi-corp.com/products-IC-X12CXP.php
