K Series3D AOI reportedly delivers accurate all-around defect coverage, including lifted components, lifted leads, tombstones, etc., for components up to 25mm in height. Couples telecentric 2D images with dual-camera blue-laser-based 3D profiles. Inspects pre- and post-reflow. Is available as an upgrade to 5K, 7K and 9K systems.

Vi Technology, www.vitechnology.com

LMWS laser marking workstation, for benchtop operation, features a Class 1 industrial design with improved functionality. Easily configurable, requiring minimal workspace, for low-volume production and R&D environments in automotive, medical, aerospace, electronic components, and battery industries. For marking metals, ceramics and many plastics, and with cutting, drilling, and welding capabilities. Powered by a 10-50W LMF fiber laser marker; same graphic user interface as other models. Separable from the base LMF, yet designed to function as one unit. Motorized Z axis and rotary stage for easy adjustment of part and focus. Spring-loaded manual door opens for 180 degree access to parts and tooling. Large viewing window for visual process monitoring. Comes with F 100, 160 and 254 lenses for marking various parts and sizes. Fume extraction port with flexible tubing for adjustment to different parts.

Amada Miyachi America, www.amadamiyachi.com

SWF LL S151 laser soldering machine comes with controlled wire feed, 100W diode laser and has a wavelength of 980nm ±10nm. Wire and wire slip use monitored via a rotary encoder control wheel. Wire roll holder is aligned so wire roll positions and roll diameters can be set. Work angle can be selected. Controlled wire feed regulates or stops wire feed when it encounters a resistance or impacts with a specific force, and avoids wire kinking by adjusting for component and handling tolerances. Air cooled. Temperature can be controlled in real time. Can preset temp. curve or pure laser power. Includes process camera for setup. Records operating data. For inline and standalone use.

Eutect, www.eutect.de/home.html?L=1

EP17HT-100 is a single-part epoxy designed to cure in 60-90 min. at 200-220°F. Formulated for potting, encapsulation, bonding and sealing applications. Cures can be accelerated at higher temperatures. Is a moderate viscosity compound that can be cast in sections up to a 0.5" thick. Is not premixed and frozen. Reportedly has an unlimited working life at room temp. Offers volume resistivity of >1015 ohm-cm. Bonds well to metals, composites, ceramics, glass and many plastics. Exhibits a tensile lap shear strength exceeding 2,700 psi at ambient temp. after being post-cured for several hours at 350-400°F. Has thermal conductivity of 4-5 BTU·in/(hr·ft²·°F). Service temp. range -100°F to +500°F.

Master Bond, www.masterbond.com