Surface-Cure Thermal Paste is stable during thermal shock testing. Fills gaps that naturally exist between two metal surfaces placed one upon the other, improving the effective range of surface area for heat transfer. Does not set. Remains malleable when rework of components is required. Resists pump-out of the thermal interface layer from the bond line, ensuring minimal degradation of effective heat dissipation. For applications that are exposed to rapid and frequent changes in temperature. Thermally stable up to 200⁰C. Applicable using conventional industrial dispensing equipment and can also be applied via screen/stencil printing directly onto the contact surfaces. Contains no solvents and can be applied to very thin films.
Electrolube, electrolube.com
BGA Solder Spheres for PBGA, CBGA, TBGA, CSP and flip chip assemblies are made using ultra micron technology from highly pure metals. Alloy compositions made using piezoelectric droplet jet technology for accurate diameter uniformity, bright shiny surface finishes and sphericity. Come in diameters of 0.75, 0.6, 0.5, 0.45, 0.3, 0.25, 0.1, 0.08, 0.07, 0.06 and 0.05mm.
Shenmao America, shenmao.com
EP3HTS-LO is a single-component epoxy for bonding, sealing and coating applications. Features silver filler; is electrically conductive with a resistivity of less than 0.001 ohm-cm. Has thermal conductivity of 12-15 BTU•in/(ft²•hr•°F). Is dimensionally stable and bonds well to metals, glass, composites, ceramics and many plastics. Withstands chemicals such as water, oils, fuels and cleaning agents. Is serviceable over the temperature range of -60°F to +400°F. Offers handling with no mixing and an unlimited working life at room temperature. Cure schedule is 45 to 50 min. at 250°F or 20 to 30 min. at 300°F. Passes ASTM E595 tests for NASA low outgassing. Is suited for use in the aerospace, electronics, microelectronics and optical industries.
Master Bond, www.masterbond.com
Mydata Agilis Feeder Repair Set converts any Agilis feeder to any of the four sizes to reduce overall feeder count and maximize production capabilities. Provides one kit for each of the sizes (3.7, 4.0, 4.7, and 5.4) for a single feeder ID. Also includes precision machined aluminum side cover plate with cover tape plow preinstalled; new spring; matching screws for re-assembly. All-aluminum construction provides greater strength and durability. Repairs feeders with broken finger tabs. All components are precision-machined replacements for the original parts. Can be installed onsite.
Count On Tools Inc., cotinc.com
AXP shadow moiré system now comes with optional Convection Reflow Emulation Module (CRE6) that allows mirroring of the thermal environment of a reflow oven while conducting warpage metrology. Features increased heating/cooling rates and improved temperature uniformity. Measures warpage on substrates up to 70mm (diameter) with sub-micron z-resolution in a convection reflow environment. Heating rates of up to 5⁰C/sec. allow measurements from 25⁰ to 275⁰C with convective heating and tightly controlled thermal uniformity.
Akrometrix, akrometrix.com
Apreo scanning electron microscope has a proprietary compound final lens design said to be capable of resolution down to 1.0nm at 1kV without the need for beam deceleration. Provides performance on nearly any sample, even if tilted or topographic.
Offers backscatter detection at low beam currents, at any tilt angle, on sensitive samples and at TV-rate imaging, for strong contrast of materials. Detector segments can be individually addressed to optimize for angular contrast or for signal intensity and extract information that matters most. Low-vacuum capability with a chamber pressure of up to 500 Pa. Has ports for up to three energy dispersive x-ray spectrometry (EDS) detectors, coplanar EDS and electron backscatter diffraction (EBSD), analytics-compatible low-vacuum, and beam currents up to 400nA. Software provides user guidance and “point-and-click” navigation using an in-chamber camera. Load multiple samples quickly and easily without tools.
FEI, fei.com/apreo