Dual-Simultaneous Programmable Pitch is for Select Coat SL-940 conformal coating. Two of the same conformal coating applicators are installed and operate simultaneously, coating two parts at the same time. Automatically repositions applicators to match programmed pitch. Reportedly reduces conformal coating process time by 50%. The pitch is programmed and will adjust automatically. Easy Coat software lets user program when to use one or both applicators.

Nordson Asymtek, www.nordsonasymtek.com

EMS 561-338 conductive adhesive for die-attach applications with small to medium size die is designed to cure in less than 1 min. at 150ºC. Is stress-absorbing to withstand thermal cycling and has conductive stability. Applicable by stencil printing or needle dispensing.

Engineered Material Systems, emsadhesives.com

Register now for PCB West, the Silicon Valley's largest trade show for the printed circuit industry, taking place Sept. 13-15 in Santa Clara: pcbwest.com

NPM-VF is a dual-gantry, multi-head, odd-form placement and insertion machine. Achieves 4,500cph throughput within narrow footprint of a compact SMT mounter. Standard vacuum nozzle handles a gamut of packages and three additional process heads available for components up to 130x35mm and 60mm tall, requiring 100N force (nearly 22.5 lbf). Has a body chuck for gripping large odd-form devices without a pick surface (e.g., power transformers), lead chuck for gripping through-hole devices (e.g., electrolytic capacitors), and swing nozzle for inserting through-hole devices oriented in packaging other than insertion orientation. Tenders myriad feeder types from bowl feeders to stackable stick, through-hole, vacuum-formed/JEDEC trays, and tape feeders up to 104mm. Active clinch system secures various through-hole lead diameters at multiple rotations. When not required, clinch doubles as localized board support for snap-in/press-fit components.

Panasonic Factory Solutions Company of America, www.panasonicfa.com

Register now for PCB West, the Silicon Valley's largest trade show for the printed circuit industry, taking place Sept. 13-15 in Santa Clara: pcbwest.com

TF 1800 BGA/SMD rework system incorporates top-side inductive-convection heater, which provides rapid heat-up and active cooling of solder joints. Inductive-convection technology allows for an active cooling feature, which provides controlled component/PCB cool down directly through the nozzle. High-efficiency, low thermal mass design reportedly takes less power to operate and is more reliable than conventional heaters. Stepper motor drives automated reflow head. Has 28µm (0.0011”) placement accuracy. Vacuum pick/shaft design with optical sensor is counterweight balanced. Includes adjustable height bottom-side IR preheater. Other features include HD vision overlay system for optical alignment with quad-field imaging capability for placement of outsized BGAs or large fine-pitch QFPs and an integrated underside board support wand to prevent warping during reflow.

Pace Worldwide

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