New Products
AKM600P warpage measurement system performs single shot warpage measurement of an entire Fan Out Wafer Level Processing (FOWLP) panel and individual die on panels up to 600 x 600 mm simultaneously. Provides z-resolution down to 1.25µm in under 2 sec. using patented Shadow Moiré technology.
Conducts warpage measurements at room temperature, or up to 300°C if thermal profiles are needed.
Akrometrix LLC, akrometrix.com
TR7700QI stop-and-go 3D AOI system is for high-mix, high-volume manufacturing including mobile and PC applications.
LD-200P electronic load can be used for testing and evaluating a variety of DC power sources. Tests up to 200W. Can operate in CC, CV, CP, or CR mode while voltage/current or resistance/power values are measured and displayed in real time. Overvoltage and overcurrent protection help protect prototypes and printed circuit boards. Operates between 1-63V, 10mA-15A (200W max.); 20mV, 1mA, 0.1W, 0.1ohms.
Global Specialties, www.globalspecialties.com
Gap Filler 3500LV is a two-part liquid material that reportedly delivers high thermal conductivity and low volatility for reduced outgassing. Cures at room temp. with the option of accelerated curing through the addition of heat. Delivers thermal conductivity of 3.5 W/m-K and mechanical property benefits of silicone. Low volatile content is controlled lot to lot. Is beneficial in applications that require optics remain free of lens fogging, such as automotive headlamps, stadium lighting and high-intensity LEDs. Once cured, it is a soft material that provides protection from shock and vibration. Has ability to fill tiny gaps and voids and has zero shrinkage.
Henkel, www.henkelna.com
Siplace BulkFeeder X eliminates component reels. Permits tapeless supply of components in sizes 0402, 0201 and 01005 for high-speed applications. Sets up like any classic feeder on changeover table, but holds up to 1.5 million components at a time. Coordinates interplay of shutter and vibration mechanisms, vision system, and placement heads. Eliminates splicing. Uses a vibrating mechanism to pour loose components from a container onto a pickup plate made of glass. Built-in camera takes a picture of the components from underneath the glass plate. The placement machine analyzes the image and determines which components are located on the plate in a position that is suitable for pickup and which are not, for example because they are upside down or too close to each other.
ASM Assembly Systems, www.siplace.com 
Mycronic 4.0 automated, intelligent factory software for just-in-time production enables visibility planning, material tracking, efficient changeovers, automated replenishment and intelligent storage solutions.
Mycronic, www.mycronic.com
