SV260 reflow vapor phase soldering machine has been redesigned. Tabletop unit offers easy front-leading, for small series and prototyping. Solders BGAs and LGAs. Handles boards sizes up to 300 x 260 x 80mm. Low energy and fluid consumption with two-chamber design and integrated heat exchanger. Live temperature monitoring without high temperature profiler. Patented maintenance-free transport system. Observation window into process chamber. 230V

IBL Technologies, ibl-tech.com

Signal Optimizer is an all-in-one software for calibration, signal creation and signal analysis of 5G candidate waveforms. Features task-based instructions that simplify complex system optimization and measurements. Brings together 5G measurement science and flexible wideband system calibrations. Can generate and analyze FBMC and F-OFDM.

Keysight Technologies, www.keysight.com

EP3UF one-component epoxy contains thermally conductive fillers with small particle sizes. Thermal resistance of 5-7 x 10-6 K•m²/W. Can be applied in bond lines as thin as 10-15µm. Thermal conductivity 9-10 BTU•in/ft²•hr•°F and volume resistivity exceeds 1014ohm-cm. Passes NASA low outgassing tests. For bonding and underfills in microelectronics packaging/assembly applications. Unlimited working life at room temperature and fast cures at temperatures down to 250°F. Tensile strength 5,000-7,000 psi and compressive strength 18,000-20,000 psi. Bonds to metals, composites, ceramics, and many plastics. Has low shrinkage upon curing. Is serviceable over temperature range of -60° to +250°F.

Master Bond, www.masterbond.com

ECM-1100 inline coating machine is used to spray coating liquid on printed circuit boards and mounted parts. Common uses include inhibiting leakage and short circuit due to humidity and contamination; inhibiting corrosion; improving fatigue life of solder joints to leadless packages, and providing mechanical support for small parts to prevent damages due to mechanical shock and vibration.

Eunil, www.eunil-ha.com