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TruView H x-ray inspection system is for horizontal inspection of medical devices, printed circuit boards, electronic components, and mechanical parts. Is for inspecting flat samples. System dimensions 48" x 36" x 65". Viewable area is 20" x 40"; max. sample size is 20" x 80".  X-ray source voltage variable up to 80kV, 90kV, 130kV, or 150kV. Sample manipulation is fully automated in x, y, z and camera tilt. Magnification up to 1000X.

Creative Electron, www.creativeelectron.com

TruView XL x-ray inspection system is large sample capable to inspect LED panels, communication backpanels, large printed circuit boards, electronic components, and mechanical parts. Viewable area is 20" x 40"; max. sample size is 20" x 80".  X-ray source voltage variable up to 80kV, 90kV, 130kV, or 150kV. Sample manipulation is fully automated in x, y, z and camera tilt. Magnification up to 1000X.

Creative Electron, www.creativeelectron.com
 

Photon steam aging system meets military and commercial reliability specifications of J-STD-002 and other applicable standards for artificial aging of all electronic components and circuit boards. Designed to accommodate all package styles including high density, discrete components, relays, transistors, capacitors, including SMT and axial components.

Hentec Industries (formerly RPS Automation), rpsautomation.com

Pulsar solderability test system provides precise handling of electronic components for automated flux and solder dipping of component terminations according to requirements of J-STD-002 and other applicable standards for the “Dip and Look” method. Reportedly can tin virtually any component from axial resistors to QFPs and other leaded and leadless packages.

Hentec Industries (formerly RPS Automation), rpsautomation.com

Dymax Multi-Cure 9451 conformal coating is a "true" black material -- a single-component, 100% solids, light and heat curable conformal coating. Is designed to enhance security on PCBs. Improves circuit reliability in harsh conditions. Opaque black color is intended to cover markings, labeling, other identification as well as sensitive information on the PCB. Formulated with a secondary heat cure, can typically be applied and cured at up to 5 mils thick -- in one pass -- for applications where shadow areas exist. Is dispensable; and can be applied in multiple passes for thicker coating requirements. Immediately tack-free after curing. Applies to glass reinforced epoxy laminates, glass and stainless steel. Complies in full with RoHS Directives 2002/95/EC and 2003/11/EC.

Dymax, dymax.com

Sarcon GAR glass fabric-reinforced thermal interface material delivers thermal conductivity of 3W/m°K, while exhibiting a thermal resistance as low as 0.17°Cin2/W. Is for complex die-cut shapes and exerts a low force on components, as it fills air gaps between the heatsink and board-level heat sources. Comes in three thicknesses: 0.2, 0.3, and 0.45mm; is offered in rolls, pre-cut sheets or can be die-cut.  V‐0 equivalent thin film is recommended for applications with operational temperatures from ‐40°C to +150°C.

Fujipoly America Corp., www.fujipoly.com 

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