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New Products

GPC-R-114 nonflammable, solvent-based cleaning liquid is for manual cleaning applications such as PBA and maintenance cleaning. Dissolves post-soldering flux residues and evaporates quickly without leaving visible residues on substrates. Is compatible will most materials used in electronics assembly and cleaning processes. Noncorrosive. Easy-to-use spray gun applicator.

Balver Zinn Group, balverzinn.com

Gap Pad HC 5.0 thermal interface material is designed to manage heat generated by reduced form factor, high-power density components. Is a soft, compliant gap filling material; has a thermal conductivity of 5.0W/m-K and delivers outstanding thermal performance with low compression stress. Is reportedly ideal for applications that require minimal component or board stress during assembly, yet demand high heat transfer across the interface with very low thermal resistance.

Henkel Adhesive Technologies, www.henkel.com/brands-and-businesses/adhesive-technologies

 

XF-603 flame-retardant material is for automotive under-the-hood and interior labeling applications. Is UL94 VTM-0 rated and third-party tested to FMVSS 302 automotive burn standard. Thermal transfer and flexographic ink-printable. XF-603 is a high-temperature polyimide rated to the UL94 V0 standard, with low smoke and toxicity and an operational temperature of 260°C. Also comes in a low-cost polyester (PET) (XF-611) that operates at 150°C.

Polyonics, www.polyonics.com

AquaRose is an automated water-based batch printed circuit board cleaner and resistivity of solvent extract (ROSE) cleanliness tester. Is 1m x 1m and includes Earth Smart closed-loop DI and chemical wash process. Automatic ROSE ionic cleanliness verification can eliminate the need to pull a sample and run a separate test. Process control features provide limits to be set, monitored and recorded for product/process traceability. Uses high-energy fluid dynamics cleaning design. Product drying times reportedly have been shortened 50% with rotating head dryers.  

Austin American Technology, www.aat-corp.com

This inspection method for fan-out wafer level packaging compares the image acquisition of the dies on the reconstructed wafer with the CAD data used in fabricating the wafer.

Camtek, www.camtek.com

Hot crimping resistance welding systems are for joining insulated copper wire to cable shoes or terminals. Miyachi Peco weld head mechanically holds electrodes and feeds electrical current to them. Integrated water cooling system actively cools all components to prevent overheating during production. Welding process monitor guards and stores electrical parameters. No metal stripping or removal, for maximum strength. Unique weld-to-displacement feature permits the equipment to be programmed to reach the specified compression, after which the current flow and heating is switched off. This compensates for part-to-part variation, and lets users program a parameter that is closely related to joint quality.

Amada Miyachi Europe, amadamiyachi.eu

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