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New Products

XF-784, a 1 mil matte antistatic, barcode tracking label material, is said to enhance print receptivity and the capability to withstand harsh fluxes and cleaning chemistry found in PCB manufacturing. Shows improved performance over the gloss coatings when exposed to a non-reflow environment prior to cleaning. Reduce charge generated on adhesive when label is removed from liner. Provides peel voltages of less than 100V per inch square. Designed to prevent significant charge buildup on the label surface, which can result in a static discharge event. Label surface resistance between 1.0 x 108 and 1.0 x 1011 ohms.

Polyonics, polyonics.com

TR7007QI stop-and-go SPI system is designed for accuracy. Is built on 3D projection technology. Automatically optimizes inspection route. SmartWarp system compensates for board warpage during inspection. Provides the choice of quad/dual projector inspection. Includes shadow-free quad/dual digital fringe projectors and 100% solder paste defect coverage, including low bridges.

Test Research Inc., http://www.tri.com.tw/en/index.html

 

Permalex-Pro R series is a reinforced blade assembly for continuous operation for high-volume SMT printing. Adapts a steel rod to the non-printing edge of the squeegee, to aid handling and assembly. Improves straightness and durability of squeegee during installation and operation.

Transition Automation, www.transitionautomation.com   

 

IW1 S151 EMS is a flexible mini-wave system based on the IW1 induction slot pump system. Nozzle receptacle is made of coated V4A and has an integrated selective shielding gas guide; shielding gas shroud lies against solder wave. Assemblies are submerged by lowering into the continually flowing solder. Solder reportedly flows in an endless loop protected from oxidation by nitrogen. Input area and part handling around the machine can be ergonomically designed. Two soldering frames are always in use; one of the frames is processed in the machine, while the second is in preparation. Solder frame is fixed to a rail, inserted into the machine, or on a turntable input manually or automatically populated. Assembly is provided with flux before soldering process begins. Flux is applied via an injection nozzle that applies flux points of 1.5mm to 3mm diameter. Can populate second solder frame with assemblies while components are being soldered. Both solder frames are exchanged in a single step. Linear axis handler receives solder frames and positions them within the machine. Solder nozzle can be replaced quickly. Point, line and matrix nozzles are available.

Eutect, www.eutect.de/home.html?L=1

 

Recipe Generator is a MOLE MAP software feature that provides reflow oven recipe generation. Is a starting point for in-spec process and development of final recipe. Is accessed from within the software’s reflow oven environment. Prompts selection of reflow oven type, board thickness, component density and solder paste type. Automatically produces reflow recipe zone temperature set points and conveyor speed. Has a drop-down menu and is Windows 10 compatible. Can be used with V-MOLE, SuperMOLE Gold 2 and MegaMOLE 20 thermal profilers.

ECD, www.ecd.com

 

HSIO validation assistant is a data mining tool for ScanWorks. Automatically analyzes database of signal integrity test data and quantifies risk associated with potential design flaws or poorly performing devices on a system’s high-speed input/output (HSIO) buses. Organizes and correlates validation database to identify vulnerabilities. Redundant validation testing can be identified and eliminated. ScanWorks HVA has been integrated into ScanWorks HSIO; validates signal integrity on high-speed buses on Intel circuit board designs.

Asset InterTech, www.asset-intertech.com

 

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