New Products
Sarcon PG80A is a low-compression, putty-like thermal interface material. The 13W/m°K gap filler pad conforms to most component shapes and uneven surfaces to transfer heat from its source to a nearby heat sink or spreader, while exhibiting a thermal resistance as low as 0.08°Cin2/W at 14 PSI. Is for applications that have delicate or wide-variation component heights and require material compression between 30% and 90%. Is available in four sheet thicknesses (0.5, 1.0, 1.5 and 2.0mm) up to a max. dimension of 300 x 200mm. Can be ordered in die-cut form. Is suited for environments with operating temperatures that range from -40° to +150°C and exhibits a UL94 flame retardant rating of V-0.
Fujipoly America, www.fujipoly.com
Malcom PCU-02V spiral viscometer conducts material testing and analysis by obtaining viscosity characteristics with a 0.2cc sample. Spiral sensor provides continuous measurement of non-Newtonian fluids with good repeatability. Measurement settings and data are available with software with or without a PC. Spiral Pump Sensor enables measurement of materials with high Thixotropy. Temperature control function allows for more accurate measurement and temperature characteristics analysis.
Malcom, www.malcom.co.jp/en/
Seika Machinery, www.seikausa.com
Tech Clip secures EMI shields to a printed circuit board. Can be attached to any circuit board using manual or high-speed automated placement equipment. Securely holds shield covers that range in thickness from 0.008” to 0.010”. Lightweight surface mount design is said to eliminate need for manual through-hole soldering and provide unencumbered access to board-level components for easy assembly, rework or maintenance. Comes in tape & reel packaging.
Leader Tech, leadertechinc.com
Model 6100 stencil cleaner cleans 29" x 29" stencils in fewer than 2 min. Also cleans wave solder pallets, oven radiators, misprinted PCBs and associated tooling used in SMT printing process. Is compatible with EnviroGuard 100% closed-loop technology and 440-R SMT VOC-free stencil cleaning detergent. Is guaranteed to clean any type of SMT solder paste from any fine-pitch stencil.
Smart Sonic, www.smartsonic.com
DS-10 dip tester monitors temperature of preheat and solder temperature sensors, in addition to conventional management items, at 50ms sampling rate. Dedicated software implements process management. Features Dip Time Sensor for accurate measurement. Optional heat-resistant cover for high-heat loads, such as nitrogen ovens. Transmits data to a PC by USB cable, creating a profile function.
Malcom, http://www.malcom.co.jp/en/products/ds-10.php
Seika Machinery, www.seikausa.com
Delomonopox VE 72768 dual-curing epoxy resin offers bonding accuracy and is resistant to substances like oil, transmission fluid, gasoline, methanol and printing ink. Designed with hardeners, it is used where bonded or encapsulated components are exposed to extreme temperatures and harsh chemicals. Permits defined glob top encapsulation in tight spaces on a printed circuit board. With light curing, glob top forms a skin and can “freeze” its shape; adhesive doesn’t flow away during heat-curing process. Curing is a two-stage process: Adhesive is light-fixed in up to 5 sec. to achieve a die shear strength of more than 1N on the FR4 PCB material; then it is briefly heat cured (for example, 30 min. at 150°C) to obtain its full strength of 50MPa on FR4. Is offered in two viscosities, one for bonding applications and another for encapsulation. Operating temperature range is from -65°C to 180°C.
Delo, www.delo.de/en/
Press Releases
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Ryder Vietnam - Phase 2: Building resilience and meeting demand
- Scanfil and Etteplan deepen their strategic partnership into production testing