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The 4800 wafer level bondtester was developed for testing wafers from 200mm up to 450mm. Paragon software provides flexibility for the creation and mapping of wafers, enabling setup of test patterns. Virtual images for each test pattern reportedly enable easy editing.

Nordson Dage, www.nordsondage.com

 

MP-520 SiP inspection system combines precision linear drive motor technology with 25MP CoaXPress camera, 3D confocal measurement system and Omni-vision 3D digital multi-frequency moiré technology. Is configured with eight phase color lighting and four 10MP side-view cameras. For measurement and inspection of solder ball/bumps, bond wire, chip bonds, discrete devices, heat sinks, underfill, printed circuit boards, and packages. Results are stored in a central database, enabling remote access SPC data through Intellisys total quality management system software.

Mirtec, www.mirtecusa.com

 

Adjust-a-Vac vacuum tweezer is for handling very thin/delicate substrates, wafers, MEMS devices and other fragile components. Can adjust vacuum level from 1-10" of mercury. Integrated 10-segment bar graph display shows vacuum level present during operation. Bar graph shows minimum vacuum pressure until part is grasped, then displays vacuum level presented to the part being handled. Vacuum port integrates a user-replaceable inlet filter.

Virtual Industries, www.virtual-ii.com

 

Master Bond MasterSil 912Med is a room temperature vulcanizing silicone system for bonding, sealing and coating. Meets USP biocompatibility and ISO cytotoxicity standards and resists a variety of sterilization techniques such as gamma radiation, EtO and some types of liquid sterilants. A one-part material offers noncorrosive cure with a tack-free time of 15-30 min. at room temperature. Translucent color; serviceable over temperature range of -75°F to +400°F. Tensile strength 700-1,100 psi. Adheres to metals, composites, ceramics, glass, rubbers, plastics and other silicone substrates. Elongation 250-350%. Volume resistivity of >1015 ohm-cm. Comes in 80g tubes and has a shelf life of 6 months.

Master Bond, masterbond.com/tds/mastersil-912med

Laser shape rings aid selection of optimal laser spot shape to fit components and land shapes to reduce circuit board problems. Come in twin-spot, circle, square, ring and oval ring. Help avoid inadvertent burning of PCBs. Twin-spot enables simultaneous soldering of two joints.

Japan Unix, japanunix.com/en/products/laser/shapes.php

• Verification video showing how incorrect laser shapes burn components: youtube.com/watch?v=iqjpVepqWbU

• Twin beams working two components simultaneously: youtube.com/watch?v=vRWr80bnCfg

JapanUnix LaserShapeRings

Pressure-Sensitive Cover Tape 2698 transparent, polyester film tape has synthetic, room-temperature, pressure-sensitive adhesive zones at its sides. Helps eliminate pick-and-place errors, minimize down-time and increase productivity. Is said to enable near-flawless placement of chips on circuit boards without sticking, static charge or contamination. Comes in standard widths and 600m reels designed to reduce changeover time and enable productivity improvements. Compatible with existing industry-standard equipment.

3M, http://www.3m.com/transport

 

 

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