New Products
M8 no-clean solder paste, developed in combination with T4 and finer lead-free alloy powders, provides stable transfer efficiencies. Novel activator system provides durable wetting action, accommodating a range of profiling processes and techniques. Is said to eliminate HiP defects on BGAs and reduce voiding on QFN/BTC components while producing bright shiny solder joints, leaving minimal, high purity residue engineered to be left in place. Based onl NC258 platform.
AIM Solder, www.aimsolder.com
Integra V1 boundary scan demo module detects integration specific faults. Demonstrates integration solutions with test methods such as functional test, in-circuit test, manufacturing defects analyzer and flying probe test. Contains various boundary scan structures, as well as non-boundary scan components. Production faults can be simulated by switch; signal states can be monitored. Additional test points allow testing of non-scannable partitions. Includes production-capable contacting options, such as test points, ribbon cable, GTAP, etc.
Goepel electronic, www.goepel.com
NPM-W2 placement machine reportedly has a 10% throughput boost and 25% more accuracy, plus a multi-recognition camera. Component range is 03015mm to 120x90mm and 150mm connectors. Features quick-change feeder carts, auto board support setup, and expanded nozzle capacity, along with an intelligent feeder.
Panasonic Factory Solutions Company of America, www.panasonicfa.com
Ionograph SMD V contamination tester has been redesigned and features optional heating capabilities and is controlled by PowerView software. Ionograph BT series comes in small, medium or large versions. Has been modified to enhance safety and ease of maintenance. Both determine cleanliness of electronic components, assemblies with SMT devices, and bare and assembled printed circuit boards.
Specialty Coating Systems, www.scsequip.com
Replacement nozzles for Panasonic NPM placement machine heads come in high-speed (8-, 12- and 16-nozzle) and multifunctional (2- and 3-nozzle) versions. Come in plastic, tool steel, and ceramic. Feature laser-marked factory barcodes. Have hard coating to provide waterproofing, prevent scratches, and increase tool life.
Count On Tools, www.cotinc.com
Stannostar HMM-1000 MSA-based, pure tin plating process is for deposition of reflowable, pure tin in medium- and high-speed equipment. Non-fluoborate process is formulated to produce matte to semi-bright pure tin deposits without oiling out of the organic compounds. Deposits are said to have consistent, stable surface morphology and are suitable as a “low whisker,” lead-free alternative finish. Pure tin deposits contain minimum organic inclusions that exhibit excellent covering power and a high degree of ductility. The deposits exhibit superb solderability and low carbon content over wide temperature and current density ranges, as well as high efficiency, low foam and uniform dissolution of anodes. For plating parts with complex geometries, including electronic housing and connectors.
Enthone, an Alent Co., www.enthone.com
