Vitrox 510XL inspects defects in PCBAs with a max. board size of 610mm x 610mm .Throughput post-reflow is 5.5 in2/sec and pre-reflow is 6.9 in2/sec. Post-reflow inspection includes missing, offset, skewed, polarity, billboard, tombstone, lifted/bent leads, excess/insufficient solder, bridging, wrong parts, and traceability. Pre-reflow coverage also includes extra part inspection. 2-D paste inspection includes paste registration, bridging, and other defects.

Vitrox, www.vitrox.com

Vigon N 600 pH-neutral defluxing agent is compatible with aluminum, copper, brass, nickel, polymers, and barcode labels. Is water-based and reportedly demonstrates excellent cleaning performance in spray-in-air equipment and dip tank processes. Can be used at short contact times and application concentrations of 15% to 20%.

Zestron, www.zestron.com

BPC-SX2 2D/3D solder paste inspection system is for printing quality analysis and production status control. Features high accuracy; no blind spots; automatic resolution switch; automatic program creation; double speed inspection by quick scanning; 2D/3D normal mode: 4,750mm²/sec.; 2D/3D high-speed mode: 8,200mm²/sec.; optical 2D/3D/axis real-time control; special lighting for green/blue PC boards; multiple slit lighting, and no pixel shift or ghost image. Inspects PCBs from 50 x 50mm to 510 x 460mm. Inspection time in standard mode is 4,750mm²/sec.

DJTECH, http://www.djtech.co.jp/

Quattro Peak L Plus is a full convection reflow soldering system. Uses newly developed Quattro-Peak-Plus concept for complex assemblies in large-batch manufacturing. Reportedly guarantees maximum process stability with high throughput.

SMT-Wertheim, http://www.smt-wertheim.com/en.html