X3 inline x-ray inspection includes new 3D reconstruction software to generate slice images for solder joint analysis. Combines selective 3D analysis with high-speed transmission x-ray. Has compact AOI module; scanning speed up to 200 cm²/sec.; CyberOptics SIM technology; AOI application range with presence and polarity tests, and a link to MIPS inspection platform.

Matrix Technologies, www.m-xt.com

Cantilever style contactors are often now available on third-party test handlers. Are said to reduce cleaning-related downtimes and extend cleaning intervals by a factor of 10 or more. Contact springs feature optimum set of all critical characteristics, such as contact force, plating, scrub and geometry. ECON, nanoKelvin, and DURA are based on Cantilever technology.

Multitest, www.multitest.com/Cantilever

MRS-1000A modular rework system now includes a BH-2000 freestanding board holder and adjustable tool holder. Comes with array of nozzles, preheater, adjustable tool holder, board holder and light magnifier.

OK International, www.okinternational.com 

iSpector desktop automated optical inspection offers one top camera and eight side cameras in 45/45° configuration. Solder joints of 45° circuitry designs can be inspected with 10µm resolution side cameras. Combines simultaneous nine camera inspection, 24-bit color imaging technology, and 3D solder meniscus profiling. 

Mek Europe BV, www.mek-europe.com