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New Products

Material Disclosure software tracks chemical ingredients in a supply chain. Is Internet-based and available by subscription. Automates and manages supply chain communication and chemical information collection processes for lifecycle assessment and compliance under global restricted lists. New features include IPC1752 xml schema importer and generator; enhanced supplier contact management tools, and advanced supplier response query tools.

Actio, http://www2.actio.net/e/1432/2011-11-02/L5VOK/320993316

Multicore HF200 is a Pb-free, zero- halogen solder paste for multiple processes, including handheld applications. Is said to be reliable, easy to process, and offers low voiding.

Henkel, www.henkel.com/electronics

Multicore MF390HR halogen-free, no-clean flux is said to offer high activity for wave soldering. Reportedly has good through-hole penetration, minimal residues and sustained performance for a broad process window. Compatible with automotive processes and consumer electronics handheld applications. 

Henkel, www.henkel.com/electronics

Ablestik ICP-3535M1 is a single component ECA for use with tin-terminated components. Reportedly has excellent electrical and adhesion stability, no bleeding or wicking on miniaturized components, and cures quickly at low temperature.

Henkel, www.henkel.com/electronics

Ablestik ICP-4000 is a high-end conductive silicone adhesive technology for automotive applications. Has been qualified for automotive sensor products where components are bonded to metal leadframes inside plastic housings. Absorbs CTE stresses, maintains bond and delivers electrical interconnect between component and leadframe.

Henkel, www.henkel.com/electronics

Remote Instrumentation Controller 4000 (RIC-4000) for ScanWorks platform for embedded instruments can connect over an Ethernet network and apply boundary scan tests on as many as four circuit boards simultaneously. Units under test and ScanWorks can be on the same local network or connected via Internet. Features four test access ports that connect the UUTs to ScanWorks, which applies test routines without physically probing the boards. Many parameters on the four TAPs can be individually configured; they don’t need to be identical. Test routines can be processed step-by-step in real time to locate faults on device pins or chip interconnects. Can be used to load programs or data into programmable devices like flash memory that have already been soldered to a circuit board.

Asset InterTech, www.asset-intertech.com

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