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MUST camera system, for MUST III solderability testers, enhances small component alignment and inspection. Provides high magnification and a precision view of part-to-solder alignment; enables monitoring of solderability testing process. Includes 1/3" CMOS color camera with 3.3x MP macro zoom lens. Features include up to 744 x 480 pixel resolution; up to 150 FPS; color to mono switching; and close-up viewing of micro components. Is retrofittable to any existing MUST system. Captures live images into various formats; captures a timed sequence of images at set intervals; zooms from 10% to 200%, rotates images, and enables AVI recording for a defined period.

GEN3 Systems, www.gen3systems.com

RED-E-SET XL series are large panel supports from 24" to 60". Are used in the ML and GO! models. Reportedly reduce changeover times, improve quality, and eliminate component damage.

Production Solutions, www.production-solutions.com

Two PXI5396-DT/x JTAG digital I/O modules on PXI bus basis support structural JTAG/boundary scan tests and I/O operations up to 100MHz for functional test executions. Feature impedance-controlled VPC interface for direct coupling to signal-critical load boards or other verification environments. Can use one test hardware for both laboratory verification and in the production line with fixture-based systems. Are based on a two-component solution, consisting of a PXI-supported interface module and an offset desktop module. Separation of the modules can be up to 2m without loss of performance. Desktop module is equipped with front connector that permits the module to be connected directly to the test environment. Two variants are available that differ in the on-board memory depth of 72MB with the PXI 5396-DT and 144MB with the PXI 5396-DT/XM. Both variants provide 96 single-ended channels, configurable as input, output and tri-state. Signals are processed synchronously to the test bus operations in the JTAG mode. Dynamic I/O mode permits functional testing with programmable clock rates within the range of 500Hz to 100MHz. Include VarioCore technology.

Goepel electronic, www.goepel.com

Halogen-free flame retardant tapes are dimensionally stable, engineered tapes specifically designed to help prevent the propagation of flames in a variety of applications. Are tested to the UL94 standard. Use FlameGard technology, which combines chemical and physical mechanisms to control heat transfer, oxygen availability, material decomposition and the generation of flammable gasses. Flame retardant single coated tapes are available in 0.001" and 0.002" polyimide and 0.002" polyester films, and 0.002" aluminum foils. Adhesives and liners are offered with a combination flame retardant/static dissipative construction.

Polyonics, www.polyonics.com

SFX-9305/R is an I/O module within the frame of Scanflex boundary scan hardware. Provides five ports for the universal test of industrial interfaces, which can be electrically isolated per relays. Can combine functional test procedures for bus interfaces such as LAN, USB, CAN or LIN with vector-less working test methods. Provides five independent, freely configurable bus ports. Target is physically accessed by a selection of bus access cables. Current configuration is automatically identified, whereby BAC type and quantity are freely definable. Number of available bus ports is nearly unlimited. Supported interfaces are LAN (10/100/1000), USB 2.0 (Host/Slave), Bluetooth, CAN (high-speed/low-speed), LIN, RS232 and RS422/458. Additional interfaces are being developed. Available interface functions contain the step-wise handling of protocol layers, including bidirectional data transfer.

Goepel electronic, www.goepel.com 

891 and 893 64-position, 1mm pitch mezzanine connectors are for parallel board stacking interconnections. Surface mount connectors have a mated height of 10mm. Provide high-density packaging. Locating posts are incorporated into housing to promote accurate placement on the PCB. Are RoHS compliant and suitable for Pb-free reflow soldering processes. Packaging is tape and reel, per EIA-783 (56mm wide; 16mm pitch). Feature 30u" gold-plated contacts. Insulator housings are made of high-temperature glass-filled LCP, rated UL 94 V-0.  Meet EIA-700 AAAB specifications for IEEE 1386 applications. This standard can be found on VME, VME64 and VME64X boards, CompactPCI boards, Multibus I and II boards, desktop and portable computers and servers; can also be used as modular connectors for front panel and backplane I/O cards.

Mill-Max, www.mill-max.com/PR623

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