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New Products

Vision 20 AOI/SPI software suite provides defect detection from 2D SPI through pre- and post-reflow and post-wave applications. Is for low-volume/high-mix production. Features offline programming capability, including program tuning. Resolution reportedly handles 01005 components.

Vi Technology, www.vitechnology.com

SMD Tower 513 XL is an automated and expandable buffer storage unit designed for near-production deployment. Ensures correct component remains stored in the correct place and in a controlled atmosphere. Is optimized for high-volume manufacturing and provides 70% more space for large reels in the same 1 m2 footprint as Tower 200. Can store up to 336 13" reels and 600 trays. Is MSD-compliant.

Mydata, www.mydata.com

A dummy version of Amkor’s CVBGA is available. The 0.3mm CVBGA is a 8x8mm, 368, 0.30mm solder ball pitch, two-layer thin core substrate with an Ni/Au BGA finish that uses a HL832NX-A (60 µm core) and AUS 410 solder mask. Is reportedly ideal to train, test and qualify. Is identical to the live package, without the IC die inside.

Practical Components, www.practicalcomponents.com

PVA6000 coating and dispensing system combines an extruded aluminum frame with sheet metal finishing. Includes a hatch similar to PVA650. Pneumatics, ventilation and facilities are fully enclosed in a cabinet at the rear of the machine. Onboard PC features Portal software; permits unlimited program storage capability, fluid level monitoring, integration of vision systems, barcode readers, flow monitors, and other options. Has updated motion platform.

PVA, www.pva.net

Genesis GX-37D is a multipurpose surface-mount platform, placing chips at high-speed. Combines Series 2 Lightning placement head with InLine7 head for a component range of 01005 passives to 150mm sq. Handles odd-form components up to 25mm tall with 2.5kg grams of placement force. Features nozzle-changer support for gripper nozzles. Provides standalone prototyping solution, or a line balancer capable of taking on component placements from up-line or down-line machines.

Universal Instruments Corp., www.uic.com

LED nozzles are designed to overcome the tackiness or stickiness of LED substrates. Use semi-rigid material made from organic compounds to create a vacuum bond with components. Reportedly improves LED component release onto the board, preventing misplaced LEDs, lost components or miss-picks. Can be applied to any style of pick-and-place nozzle for any OEM or machine type.

Count On Tools, www.cotinc.com

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