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New Products

ESLE-10 one-part silver-loaded epoxy resin for conductive bonding offers mechanical bonds and electrical conductivity. Reportedly has excellent adhesion; can be used as a conductive bond between solder-free surface mount connections, solder repairs, static discharge and grounding or general conductive adhesions. Operating temperature is -30 to +130°C. Has an electrical resistivity value of <0.0005 ohm-cm.

ES501 underfill resin is said to improve adhesion strength of devices during mechanical stress. Reportedly does not compromise thermal cycle performance. Can be reworked, and used in high-volume assembly. Provides void-free underfill of area array devices; has snap-curable properties. Typical curing times of 35-40 min. at 90°C or 3 min. at 150°C.

Electrolube, www.electrolube.com

PVA selective coating platforms now come with conformal coating inspection. Provides UV inspection capability to check for coated and uncoated areas of a printed circuit board. Camera option combines selective coating and automated UV spot inspection within the same machine; can detect presence and/or absence of coating and helps ensure coating is not in "keep out" zones. Locations to inspect are fully programmable. A high-power UV ring light is included for coating illumination; is for use with coatings that fluoresce under UV black light.

PVA, www.pva.net

Component counters are said to handle all part sizes, including 01005s. Detect missing parts while deducting them from the total. Include handheld and motorized versions. Handles surface-mount and through-hole (axial and radial leaded) components. Another model includes a barcode reader and scanner, plus a label printer that outputs quantity, lot number, company name and barcode. Software counts SMDs directly on the pick-and-place machine.

Manncorp, www.manncorp.com

Mascot hand assembly workstation is for attaching through-hole and odd form insertion, inspection and printed circuit board rework. Is said to eliminate setup time; good for high mix, small- to medium-sized batch runs. Can reportedly reduce mistakes by 60%. Does not require training. Program changes can be made quickly.

Robotas Technologies, http://www.robotas.com/standalone.html

TCQ automatic tray changer reportedly can replace a component tray in fewer than 5 sec. and align it with accuracy better than 50µm. The 18-bin changer comes on Cobra and Paraquda pick-and-place machines. Trays are stored in a magazine equipped with handles; can be replaced quickly. Standard magazines feature 18 or 14 slots, depending on tray thickness. Each slot has room for one standard Jedec tray; the space can be divided for several smaller trays.

Essemtec, www.essemtec.com  

ES 808 surface mount adhesive is for bonding of surface-mounted devices to printed circuit boards prior to wave soldering. Is for medium to high dispense speeds and high dot profiles; is suitable for pin transfer and stencil print. Is said to have good humidity resistance, high wet strength and good electrical characteristics, excellent mechanical strength and long-term stability. ES 807 is for high-speed dispensing (25,000 - 50,000 dph). Reportedly has outstanding dot profile, excellent adhesion substrate and wetting strength. Typical cure temperature of 130°C and 90 sec. cure time or 60 sec. at 150°C.

Electrolube, www.electrolube.com

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