SI-F1000 series micro-head spectral-interference laser displacement sensor is designed to provide high-precision performance in a 2mm diameter sensor head. Is a low power optical system using fiber-optic detecting; measurements can be taken without electromagnetic effects or additional head to measurement system. External signal processing is eliminated. Controller models include built-in digital and analog data outputs. Includes onboard data storage and calculation functions. Applications include wafer thickness and warpage mapping; media thickness and surface characterization, and inline thickness measurement of transparent webs and coatings.

Keyence, www.keyence.com/PRSI

TMV (through mold via) 14mm board drop test Pb-free kit is designed for Amkor TMV component. Eight-layer test board is a 3x5 array with 15 component placements per board. Is 132 x 77mm and 1mm thick. Standard surface finish is OSP. Is designed for TMV 620 solder ball 0.4mm pitch bottom component and TMV 200 solder ball 0.5mm top component. Both have a daisy chain pattern through the substrate of the part; daisy chain pattern also runs through the test board.

Practical Components, www.practicalcomponents.com

Right-angle Q Rate 5mm body design connectors are for backplane and other high-speed applications with coplanar and perpendicular applications. Ground/power plane of QRM8-RA and QRF8-RA series permits contacts to be placed closer together without degrading signal performance. Equipped with ground/power plane and signal-integrity-optimized Edge Rate contacts. Surface of contacts increases wear life; minimizes effects of broadside coupling. Robust when mating and unmating; features a long contact wipe. 0.8mm pitch right-angle system is dual-row and available in 1, 2 or 3 banks, with up to 78 positions per row. Optional guideposts for blind mating are available. Also available in a vertical orientation with stack heights from 7 to 14mm.

Samtec, www.samtec.com

MT2168 provides short index time, fast loading and sorting, and high soak capacity. With no handler limitations, enhanced tester capabilities permit optimization of test cell throughput with shorter test times and the use of higher parallelism. Is optimized for single parameters (parallelism and speed) and synchronized internally with respect to the number of contact sites, as well as loading, soaking and sorting capacity.

Multitest, www.multitest.com