New Products
Fine-Pitch SMT Kit now comes in both Pb-free and SnPb versions. Pb-free component option comes with ENIG finish. Used to determine overall production or machine process capability of fine-pitch components. Custom component list optional.
STI Electronics Inc., www.stielectronicsinc.com
Replacement ZFF 250 Pre-Filters are low efficiency particle filters used to protect components within the SMT pick-and-place system from dust and other large, coarse debris. With the specially designed polymedia filter material along with iFuse coating, extend the life of SMT equipment by offering increased performance and protection against dust and debris. Fit the full range of Mydata pick-and-place systems.
Count On Tools, www.cotinc.com
SCS Ionograph ionic contamination tester now features an all-in-one onboard computer for control and monitoring. PowerView software displays the percent of alcohol present in solution, and provides mL of alcohol or water needed to achieve 75% IPA. Filters test data by profile, part number, lot number, pass/fail, and/or test date range. Displays results in a graphical summary. Can zoom in/out to view specific aspects, save in various formats, print, and use data. Uses ‘dynamic’ testing method to determine cleanliness of electronic components, assemblies with SMT devices, and bare and assembled PCBs.
Specialty Coating Systems, www.scscoatings.com
EBM soldering iron tips are available in two series. One series is compatible with Hakko’s 900M series of soldering equipment; the other uses Curie Heat Technology. Are 100% tested and offer easy temperature identification. Reportedly have better contact points and tip plating that’s conducive to longer life.
Easy Braid Co., www.easybraidco.com
Correct-A-Chip series Fine Pitch Bump Adapters accommodate pitches down to 0.40 mm. Can use higher pitch devices on smaller pitch boards. Tops have landing pads that can be designed to accept any device on any pitch and settle into fine pitch footprints including TSSOP and QFP with pitches down to 0.40 mm. Bottom has raised connection pads up to 0.010". Integrate higher pitch BGA devices with boards laid out with smaller pitches. Apparatus can operate up to 221°F for FR4 and 266°F for Pb-free. Come in tape and reel. Standard line and trace spacing down to 0.003" can be used. Available in panelized form, adapter only, or with devices mounted.
Aries, www.arieselec.com
Paradigm v.3.7 with a system alerts module is an ERP solution that now includes a plan by MRP function; generates and automates an action list of the required transactions that result after running MRP. Includes a non-nettable raw material processing feature; categorizes raw materials suspected of being defective, so as to not be used in MRP reporting. Various usability and user interface enhancements were also incorporated. The SAM module delivers real-time notifications via mobile device or PC; includes more than 50 alerts regarding sales, production, quality, materials, finance and maintenance; is compatible with Paradigm v.3.4 and higher.
Consona Corp., www.consona.com
Press Releases
- Surf-Tech Manufacturing Corp. Ensures World-Class Quality with Advanced Conformal Coating Services
- Luminovo Partners with Sluicebox to Offer an Industry-First Instant Product Carbon Footprint for Electronics
- The Assembly Show and SMTAI Announce Colocation in October
- SIA Applauds CHIPS Act Incentives for GlobalWafers Projects in Texas and Missouri