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Uniflow3 power supply is for resistance soldering, heat sealing and conductive adhesive bonding applications. Replaces Uniflow2 power supply, and features hardware improvements, new process control features, upgraded limit and alarm options, and user interface upgrades. Uses pulsed heat technology; provides targeted heating and precision temperature control for flex circuits, ribbon cables, wires, SMT components, single or dual-sided edge connectors and thermocompression bonding of gold ribbon. Is used in the assembly of medical devices, cellphones, onboard computers, LCD monitors, laptops, and cockpit instrumentation and displays.

Miyachi Unitek, www.miyachiunitek.com  

Value Line of low-humidity desiccant cabinets includes three models, with internal capacities of 7, 22 and 44 ft.3. Prevents defects to components and assemblies caused when moisture content becomes vaporized if soldered under high temperatures. Safely stores MSD trays and reels for extended periods in an RH atmosphere of 5% or less. Each of the models provides two or more turbo modules designed to rapidly decline RH to this level without use of nitrogen or compressed air.

Manncorp, www.manncorp.com

BPWin version 5.10 features benefits for software support, such as email notifications, black box log visualization and label printing. An email notification feature for automated programming systems sends instant notifications of system events, plus a job summary report. Can set up email notifications to multiple users or a single user when a certain job event takes place. Black box log files can be viewed graphically with the log visualization feature. With color-coded data and letter-designated events, the log visualization feature can help determine what set of circumstances contributed to an unexpected event or other performance metric. Identifies and maintains programmed device traceability. Prints labels using dynamic data from the current job, such as device quantity, job master file name, job ID, device part number, data pattern information and system information. Interfaces with printer using Windows print driver and a text-based command language. Generates text, barcodes and RFID tags.

BPM Microsystems, www.bpmicro.com/bpwin-features.html

XPM3i reflow system has an enhanced atmosphere recirculation system said to deliver nitrogen savings of up to 50%. Can be equipped with dual-lane, dual-speed conveyor option for high-mix processing. Includes new software features. Is equipped with AUTOset fast setup; makes it possible to accelerate process development by generating a preliminary reflow recipe based on PCB assembly’s physical characteristics. Can fine-tune preliminary recipe if needed; 85% of the time, modifications are not needed.

Vitronics Soltec, www.vitronics-soltec.com

Space-Saver BNC connector mounts on the edge of a PCB. Provides low profile for applications with tight vertical constraints. Reduces twisting stress on solder joints inherent in BNC connector mating. A notch in the connector slips over PCB edge prior to soldering, forming a tight mechanical fit that transfers majority of rotational energy to the PCB instead of solder joints. Center pin and connector body are soldered directly to a PCB, minimizing antenna effect caused by elevated mounting approaches and associated EMI/RFI problems at higher frequency ranges. Has a 75 ohm impedance and is tested to 2 Ghz.

Regal Electronics Inc., www.regalusa.com

The Fine Silver Conductor Trial Kit is capable of producing fine silver conductor traces down to 50 µm for high-density thick film circuits. Can experiment with fine polymer thick film circuits and functional printable and flexible electronics without screen printing equipment. Includes screen mask with standard fine patterns, a printing table, 50 g special silver ink, flexible substrates, squeegee, and other materials. Working table and thermal oven required.

DKN Research, www.dknresearch.com

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