High-density, 0.050" pitch through-hole and surface mount spring-loaded connectors come in single and double-row strip packaging. Spring pin components are plated with 20 µm hard gold and assembled in a high-temperature thermoplastic insulator suitable for wave and reflow soldering processes. Are RoHS-compliant.

Series 854-22-0XX-10-001101 and 855-22-0XX-10-001101 through-hole insulators feature molded standoffs. Tail diameters of 0.016" require minimal diameter plated holes for connector mounting. Surface mount spring connectors are low profile, standing less than 0.230" tall when engaged mid-stroke (0.0275").  Each SMT spring pin features a base geometry of 0.030" round by 0.010" tall.

Through-hole (Series 856-10-0XX-10-051000 and 857-10-0XX-10-051000) and surface mount (Series 856-10-0XX-30-051000 and 857-10-0XX-30-051000) 0.050" pitch target connectors provide a gold-plated, flat and conductive mating surface for the 854/855 series. Series 856/857 are precision-machined and assembled into thermoplastic insulators. Suitable for reflow soldering.

Mill-Max, www.mill-max.com

K4000 PCB singulator depanelizes skip-scored PCB panels up to 24" long. Operates via foot switch; right and left blade guards assure safety. Front and back support and take-up table are height adjustable. Optional light beam safety curtain across the front of the blades, as well as a conveyor belt. IR sensor at conveyor end stops belt for PCBs with components. Scrap pieces pass underneath the sensor beam into a discard bin. Tooling to help align panels also available.

FKN Systek, www.fknsystek.com

ScanWorks toolkit for embedded instruments validates connectivity of DDR3 memory chips with certain Intel processors. Verifies performance of the bus that connects DDR3 memory devices to Intel’s processors based on the micro-architecture codenamed Sandy Bridge. Employs Intel IBIST embedded instrumentation to drive data patterns onto the bus that connects the processor to DDR3 devices. These patterns form the basis for tests that verify the read/write capabilities of the memory bus. Operational parameters on the bus such as voltage and signal timing can be modulated.

Asset InterTech, www.asset-intertech.com

LED BIN validation and traceability software validates SMT line setup by tracking each reel to its feeder and specified feeder location on the machine; ensures each replacement reel contains LEDs with a correct and compatible brightness index number. Generates traceability reports based on the BIN of each LED reel used. Forces the machine to stop processing when a process validation error occurs. Reduces machine downtime during product changeovers and feeder replenishments. Each component reel load/unload event is logged in a central database. Component-level data can be linked with the actual product/PCB lot number, work order or serial number.

Cogiscan, www.cogiscan.com